ABSTRACT
This study presents a detailed fabrication method, together with validation, discussion, and analysis, for state-of-the-art silicon carbide (SiC) etching of vertical and bevelled structures by using inductively coupled plasma reactive ion etching (ICP-RIE) for microelectronic applications. Applying different gas mixtures, a maximum bevel angle of 87° (almost vertical), large-angle bevels ranging from 40° to 80°, and small-angel bevels ranging from 7° to 17° were achieved separately using distinct gas mixtures at different ratios. We found that SF6 with additive O2 was effective for vertical etching, with a best etching rate of 3050 Å/min. As for the large-angle bevel structures, BCl3 + N2 gas mixtures show better characteristics, exhibiting a controllable and large etching angle range from 40° to 80° through the adjustment of the mixture ratio. Additionally, a Cl2 + O2 mixture at different ratios is applied to achieve a small-angel bevels ranging from 7° to 17°. A minimum bevel angel of approximately 7° was achieved under the specific volume of 2.4 sccm Cl2 and 3.6 sccm O2. These results can be used to improve performance in various microelectronic applications including MMIC via holes, PIN diodes, Schottky diodes, JFETs' bevel mesa, and avalanche photodiode fabrication.
ABSTRACT
The effect of the fluorination of aluminum oxide (Al2O3) in an oxide-nitride-aluminum oxide (SiO2-Si3N4-Al2O3, ONA) layer through fluorine (F) ion and neutral-beam treatments on the characteristics of the ONA layer was investigated to study the effect of charge-related damage during F ion beam treatment. The treatment with an F beam at approximately 10 eV energy produced an about-5-nm-thick fluorinated alumina layer by replacing the aluminum-oxygn (Al-O) bonding with Al-F bonding for both the F neutral-beam and F ion beam treatments. Moreover, no significant differences in the physical and chemical properties of the ONA layers treated with the two beams were observed. When the electrical characteristics of the metal-oxide-semiconductor (MOS) devices were compared, however, the lowest leakage current and highest memory window characteristics were observed in the MOS device fabricated with an F neutral beam, due to the Al-F layer formed on the Al2O3 surface. In the case of the MOS device fabricated with the F-ion-beam-treated ONA layer, however, lower electrical characteristics were observed compared to the MOS device fabricated with the F-neutral-beam-treated ONA layer, possibly due to the charge-related damage that occurred during the F ion beam treatment, even though the memory characteristics were improved compared to the reference due to the Al-F layer formed on the Al2O3 surface.
