ABSTRACT
In the field of high-frequency communications devices, there is an urgent need to develop high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame retardancy and thermal stability. The hydrocarbon resin styrene-butadiene block copolymer (PSB) was modified with the flame-retardant 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide/polyhedral oligomeric silsesquioxanes (DOPO-POSS) to meet the demands of high-frequency and high-speed applications. The resulting DOPO-POSS-modified PSB was used as the resin matrix along with other additives to fabricate PSB/DOPO-POSS laminates. At a high-frequency of 10 GHz, the laminates containing 20 wt.% of DOPO-POSS and with a thickness of 0.09 mm exhibited a Df of 0.00328, which is much lower compared with the commercial PSB/PX-200 composite (Df: 0.00498) and the PSB without flame retardancy (Df: 0.00453). Afterwards, glass fiber cloth (GF) was used as a reinforcing material to manufacture GF-PSB/DOPO-POSS composite laminates with a thickness of 0.25 mm. The flame retardancy of GF-PSB/DOPO-POSS composite laminate reached vertical burning (UL-94) V-1 grade, and GF-PSB/DOPO-POSS exhibited higher thermal and dynamic mechanical properties than GF-PSB/PX-200. The results of a limited oxygen index (LOI) and self-extinguishing time tests also demonstrated the superior flame-retardant performance of DOPO-POSS compared with PX-200. The investigation indicates that GF-PSB/DOPO-POSS composite laminates have significant potential for use in fabricating a printed circuit board (PCB) for high-frequency and high-speed applications.
ABSTRACT
Although thermosetting polyphenylene oxide- (PPO) based composites with excellent dielectric properties have been widely accepted as superior resin matrices of high-performance copper clad laminate (CCL) for 5G network devices, there has been limited information regarding the composition-process-structure-property relationships of the systems. In this work, the effects of peroxide initiator concentration on the structure and dielectric properties of a free radical cured ultralow loss PPO/Triallyl isocyanate (TAIC) composite system were studied. As expected, the glass transition temperature (Tg) and storage modulus increased with the advancing of crosslinking, whereas the dielectric loss showed an "abnormal" rise with the increase in crosslink density. Extensive studies were carried out by varying the initiator contents and characterizing the structure with spectroscopy, thermal analysis, and positron annihilation lifetime spectrum (PALS) techniques. The results show that the competition of polarity, crosslink density, free volume, and free TAIC are the key factors determining the dielectric properties of the composites.
ABSTRACT
Controlling the interface interaction of polymer/filler is essential for the fabrication of high-performance polymer composites. In this work, a core-shell structured hybrid (SiO(2)-GO) was prepared and introduced into an epoxy polymer matrix as a new filler. The incorporation of the hybrid optimized the modulus, strength and fracture toughness of the composites simultaneously. The ultrathin GO shells coated on silica surfaces were regarded as the main reason for the enhancement. Located at the silica-epoxy interface, GO served as an unconventional coupling agent of the silica filler, which effectively enhanced the interfacial interaction of the epoxy/SiO(2)-GO composites, and thus greatly improved the mechanical properties of the epoxy resin. We believe this new and effective approach that using GO as a novel fillers surface modifier may open a novel interface design strategy for developing high performance composites.
