Micro-coil probes for magnetic intracortical neural stimulation: Trade-offs in materials and design.

Neural probes for intracortical neuromodulation in the brain have advanced with the developments in micro- and nanofabrication technologies. Most of these technologies for the intracortical stimulation have relied on the direct electrical stimulation via electrodes or arrays of electrodes. Generating electric fields using time-varying magnetic fields is a more recent neuromodulation technique that has proven to be more specifically effective for the intracortical stimulation. Additionally, current-actuated coils require no conductive contact with tissues and enable precise tailoring of magnetic fields, which are unaffected by the non-magnetic nature of the biological tissue and encapsulation layers. The material and design parameter space for such micro-coil fabrication can be optimized and tailored to deliver the ideal performance depending on the parameters needed for operation. In this work, we review the key requirements for implantable microcoils including the probe structure and material properties and discuss their characteristics and related challenges for the applications in intracortical neuromodulation.

Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors.

Active matrix, flat-panel imagers (AMFPIs) employing a 2D matrix of a-Si addressing TFTs have become ubiquitous in many x-ray imaging applications due to their numerous advantages. However, under conditions of low exposures and/or high spatial resolution, their signal-to-noise performance is constrained by the modest system gain relative to the electronic additive noise. In this article, a strategy for overcoming this limitation through the incorporation of in-pixel amplification circuits, referred to as active pixel (AP) architectures, using polycrystalline-silicon (poly-Si) TFTs is reported. Compared to a-Si, poly-Si offers substantially higher mobilities, enabling higher TFT currents and the possibility of sophisticated AP designs based on both n- and p-channel TFTs. Three prototype indirect detection arrays employing poly-Si TFTs and a continuous a-Si photodiode structure were characterized. The prototypes consist of an array (PSI-1) that employs a pixel architecture with a single TFT, as well as two arrays (PSI-2 and PSI-3) that employ AP architectures based on three and five TFTs, respectively. While PSI-1 serves as a reference with a design similar to that of conventional AMFPI arrays, PSI-2 and PSI-3 incorporate additional in-pixel amplification circuitry. Compared to PSI-1, results of x-ray sensitivity demonstrate signal gains of approximately 10.7 and 20.9 for PSI-2 and PSI-3, respectively. These values are in reasonable agreement with design expectations, demonstrating that poly-Si AP circuits can be tailored to provide a desired level of signal gain. PSI-2 exhibits the same high levels of charge trapping as those observed for PSI-1 and other conventional arrays employing a continuous photodiode structure. For PSI-3, charge trapping was found to be significantly lower and largely independent of the bias voltage applied across the photodiode. MTF results indicate that the use of a continuous photodiode structure in PSI-1, PSI-2, and PSI-3 results in optical fill factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of approximately 560 e (rms) for PSI-3.

Vertically integrated thin film color sensor arrays for imaging applications.

Large area color sensor arrays based on vertically integrated thin-film sensors were realized. The complete color information of each color pixel is detected at the same position of the sensor array without using optical filters. The sensor arrays consist of amorphous silicon thin film color sensors integrated on top of amorphous silicon readout transistors. The spectral sensitivity of the sensors is controlled by the applied bias voltage. The operating principle of the color sensor arrays is described. Furthermore, the image quality and the pixel cross talk of the sensor arrays is analyzed by measurements of the line spread function and the modulation transfer function.