ABSTRACT
We demonstrate a high speed GeSi electro-absorption (EA) modulator monolithically integrated on 3 µm silicon-on-insulator (SOI) waveguide. The demonstrated device has a compact active region of 1.0 × 55 µm(2), an insertion loss of 5 dB and an extinction ratio of 6 dB at wavelength of 1550 nm. The modulator has a broad operating wavelength range of 35 nm and a 3 dB bandwidth of 40.7 GHz at 2.8 V reverse bias. This compact and energy efficient modulator is a key building block for optical interconnection applications.
Subject(s)
Germanium/chemistry , Optical Devices , Silicon/chemistry , Telecommunications/instrumentation , Absorption , Computer-Aided Design , Equipment Design , Equipment Failure Analysis , Light , Scattering, RadiationABSTRACT
We demonstrate a compact, single-chip 40-channel, dense wavelength division multiplexing (DWDM) variable attenuator multi/demultiplexer (VMUX/DEMUX) by monolithic integration of an echelle grating and high-speed p-i-n VOA on the silicon-on-insulator (SOI) platform. The demonstrated device has a flat-top filter shape, on chip loss of 5.0 dB, low PDL of 0.3 dB after compensation of the polarization dependent frequency (PDF) shift, a fast attenuation response speed of 3 MHz, and an area of only 25 mm by 10 mm.
