ABSTRACT
Homogeneously dispersed copper nanowire (CuNW) materials are the basis for practical applications in many types of electronic devices. At present, the dispersion of CuNWs in water is achieved through polymeric spatial site resistance effects primarily and the electrostatic dispersion mechanism in a few. However, the electrical conductivity of CuNWs could be weakened by the excessive addition of polymers; therefore, it is difficult to maintain a stable dispersion enduringly for surface charge modifiers. Based on the coagulation mechanism of colloids, a novel antisedimentation mechanism is refined by this work. Directed by this mechanism, a stable reciprocal-supporting antisedimentation conductive CuNW ink was achieved enduringly and a uniform conductive coating (1.81-5.65 Ω·sq-1) was successfully manufactured. The tannic acid-polyethylene imine (TA-PEI) could support copper nanowires to maintain a stable height of 61.4% after 15 days best, while CuNWs in other systems would settle completely in one day. Meanwhile, the TA-PEI composite cluster antisedimentation network not only provided massive spatial potential resistance for CuNWs but also modified the surface charge of CuNWs. CuNWs were dispersed stably in this phenol-amine@CuNW network. Furthermore, the CuNWs were crosslinked more tightly with each other relying on the vigorous adhesive properties of TA-PEI. With this antisedimentation mechanism and simple treatment process, CuNW ink will be utilized in more applications.
