ABSTRACT
As an emerging additive manufacturing technology, inkjet printing has been increasingly applied in microelectronics field. However, due to the impacting and rebounding behaviors of conductive ink droplets impinging onto flat substrates, it is challenging to fabricate conductive lines with desired quality, such as suitable line width and line thickness, and matching resistance when it is used for interconnecting multifarious electronic components if there is not a proper configuration of operating parameters. To address this research gap, this article aims to investigate the effect of process parameters on the quality of conductive lines, including the platform temperature, printing speed, number of layers, and delay time (droplet interarrival time), are selected to conduct a full factorial experiment. First, the approximate parameter ranges for ensuring the continuity of conductive lines are determined. Second, this study analyzes the interactive effect among process parameters on line quality. Third, an artificial neural network (ANN) is constructed to predict the quality of printed lines. Results show that the line width does not increase with an increased number of layers, while the line thickness shows an increasing trend. The low resistance and high aspect ratio of printed line are achieved by printing 5 layers with the platform temperature of 70°C, the delay time of 12.2 ms, and the printing speed of 1139.39 mm/min. Moreover, the ANN model can be used to predict line width and line thickness with excellent performance, except for the resistance due to the irregular line edge. This study provides a useful guide for the selection of appropriate printing parameters to realize a diverse range of quality properties for 3D printed conductive lines in integrated circuits.
ABSTRACT
Additive manufacturing of conductive layers on a dielectric substrate has garnered significant interest due to its promise to produce printed electronics efficiently and its capability to print on curved substrates. A considerable challenge encountered is the conductive layer's potential peeling due to inadequate adhesion with the dielectric substrate, which compromises the durability and functionality of the electronics. This study strives to facilitate the binding force through dielectric substrate surface modification using concentrated sulfuric acid and ultraviolet (UV) laser treatment. First, polyetheretherketone (PEEK) and nanoparticle silver ink were employed as the studied material. Second, the surface treatment of PEEK substrates was conducted across six levels of sulfuric acid exposure time and eight levels of UV laser scanning velocity. Then, responses such as surface morphology, roughness, elemental composition, chemical bonding characteristics, water contact angle, and surface free energy (SFE) were assessed to understand the effects of these treatments. Finally, the nanoparticle silver ink layer was deposited on the PEEK surface, and the adhesion force measured using a pull-off adhesion tester. Results unveiled a binding force of 0.37 MPa on unmodified surface, which escalated to 1.99 MPa with sulfuric acid treatment and 2.21 MPa with UV laser treatment. Additionally, cross-approach treatment investigations revealed that application sequence significantly impacts results, increasing binding force to 2.77 MPa. The analysis further delves into the influence mechanism of the surface modification on the binding force, elucidating that UV laser and sulfuric acid surface treatment methods hold substantial promise for enhancing the binding force between heterogeneous materials in the additive manufacturing of electronics.
ABSTRACT
The application of integrated municipal solid waste (MSW) management has become increasingly common for the mitigation of the ever-growing MSW stream. However, despite their popularity across the globe, little is known about the performance of integrated MSW management (MSWM) plants. This study quantitively investigates the environmental and economic performance of an integrated MSW treatment center in the city of Horqin Left Rear Banner, Inner Mongolia Province, China, using a combined life cycle assessment (LCA) and life cycle costing (LCC) methodology. Results indicate that the integrated MSWM plant is sustainable in both environmental and economic aspects, as the life cycle environmental impacts and economic costs can be offset by substituting virgin products with recycled counterparts. Amongst the included treatments, MSW separation, brick making and plastic recycling are the greatest contributors to the total environmental burdens and economic expenses. LCC results demonstrate that the equipment cost, tax and other asset costs are the greatest contributors to the total costs of the plant. Sensitivity analysis confirms that the increasing source separation ratio results in the reduction of environmental burdens and economic expenses via the usage of biogas and photovoltaic power. Furthermore, we offer recommendations for the promotion of the environmental and economic sustainability of integrated MSW treatment facilities.
ABSTRACT
Magneto-Acousto-Electrical Tomography (MAET) is a novel hybrid modality that can provide a high spatial resolution in determining the electrical conductivity of biological tissue. The present paper primarily analyzes the existing basic formulations with the MAET, derives the propagation equations of the sound wave when the mass density of the biological tissues are variable, and then solves the respective current density and potential difference in an inhomogeneous and homogeneous density medium based on the sound speeds obtained. Finally, numerical simulations are performed. As is shown, sound waves affect magneto-acousto-electrical tomography while varying the biological tissue mass density.
