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1.
Sci Rep ; 5: 11814, 2015 Jul 03.
Article in English | MEDLINE | ID: mdl-26139015

ABSTRACT

This paper focuses on the improvement of a relaxor ferroelectric terpolymer, i.e., poly (vinylidene fluoride-trifluoroethylene-chlorofluoroethylene) [P(VDF-TrFE-CFE)], filled with a bis(2-ethylhexyl) phthalate (DEHP). The developed material gave rise to a significantly increased longitudinal electrostrictive strain, as well as an increased mechanical energy density under a relatively low electric field. These features were attributed to the considerably enhanced dielectric permittivity and a decreased Young modulus as a result of the introduction of only small DEHP plasticizer molecules. In addition, the plasticizer-filled terpolymer only exhibited a slight decrease of the dielectric breakdown strength, which was a great advantage with respect to the traditional polymer-based electrostrictive composites. More importantly, the approach proposed herein is promising for the future development and scale-up of new high-performance electrostrictive dielectrics under low applied electrical fields through modification simply by blending with a low-cost plasticizer. An experimental demonstration based on a flexible micro-fluidic application is described at the end of this paper, confirming the attractive characteristics of the proposed materials as well as the feasibility of integrating them as micro-actuators in small-scale devices.

2.
Rev Sci Instrum ; 80(2): 023901, 2009 Feb.
Article in English | MEDLINE | ID: mdl-19256656

ABSTRACT

This paper describes a microtensile test system and the design as the realization of the samples dedicated to the tensile experiments. Two different technologies for the development of miniaturized specimens are detailed: self-standing tensile samples sustained by silicon frames and metal on polymer specimens obtained by laser cutting. The design of the samples has been optimized by means of finite element simulations. Aluminum beams with very large length on thickness ratio have been released from their silicon substrate using a standard etching process. Stress/strain curves are derived from experimental force/displacement values and discussed in terms of Young's modulus values and critical parameters (flow and rupture stresses).

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