ABSTRACT
Stencil printing is the most crucial process in reflow soldering for the mass assembly of electronic circuits. This paper investigates different machine learning-based methods to predict the essential process characteristics of stencil printing: the area, thickness, and volume of deposited solder paste. The training dataset was obtained experimentally by varying the printing speed (from 20 to 120 mm/s), the size (area ratio from 0.35 to 1.7) of stencil apertures, and the particle size (characterized by a log-normal distribution) in the solder paste. Various machine learning-based methods were assessed; ANFIS-adaptive neuro-fuzzy inference systems; ANN artificial neural networks (with different learning methods); boosted trees, regression trees, SVM-support vector machines. Each method was optimized and fine-tuned with hyperparameter optimization, and the overfitting phenomenon was also prevented with cross-validation. The regression tree was the best performing approach for modelling the stencil printing, while ANN with the Bayesian regularization learning method was only slightly worse. The presented methodology for fine-tuning, parameter optimization, and the comparison of different machine learning-based methods can easily be adapted to any application field in electronics manufacturing.
