Probing Stereoselectivity in Ring-Opening Metathesis Polymerization Mediated by Cyclometalated Ruthenium-Based Catalysts: A Combined Experimental and Computational Study.

The microstructures of polymers produced by ring-opening metathesis polymerization (ROMP) with cyclometalated Ru-carbene metathesis catalysts were investigated. A strong bias for a cis,syndiotactic microstructure with minimal head-to-tail bias was observed. In instances where trans errors were introduced, it was determined that these regions were also syndiotactic. Furthermore, hypothetical reaction intermediates and transition structures were analyzed computationally. Combined experimental and computational data support a reaction mechanism in which cis,syndio-selectivity is a result of stereogenic metal control, while microstructural errors are predominantly due to alkylidene isomerization via rotation about the Ru═C double bond.

Measuring electro-mechanical properties of thin films on polymer substrates.

In order to advance flexible electronic technologies it is important to study the electrical properties of thin metal films on polymer substrates under mechanical load. At the same time, the observation of film deformation and fracture as well as the stresses that are present in the films during straining are also crucial to investigate. To address both the electromechanical and deformation behavior of metal films supported by polymer substrates, in-situ 4 point probe resistance measurements were performed with in-situ atomic force microscopy imaging of the film surface during straining. The 4 point probe resistance measurements allow for the examination of the changes in resistance with strain, while the surface imaging permits the visualization of localized thinning and crack formation. Furthermore, in-situ synchrotron tensile tests provide information about the stresses in the film and show the yield stress where the deformation initiates and the relaxation of the film during imaging. A thin 200 nm Cu film on 23 µm thick PET substrate will be used to illustrate the combined techniques. The combination of electrical measurements, surface imaging, and stress measurements allow for a better understanding of electromechanical behavior needed for the improvement and future success of flexible electronic devices.

Ductile film delamination from compliant substrates using hard overlayers.

Flexible electronic devices call for copper and gold metal films to adhere well to polymer substrates. Measuring the interfacial adhesion of these material systems is often challenging, requiring the formulation of different techniques and models. Presented here is a strategy to induce well defined areas of delamination to measure the adhesion of copper films on polyimide substrates. The technique utilizes a stressed overlayer and tensile straining to cause buckle formation. The described method allows one to examine the effects of thin adhesion layers used to improve the adhesion of flexible systems.

Quantitative determination of F:O ratios in rare earth oxide fluorides by energy dispersive X-ray analysis.

The F:O ratio in homogeneous and inhomogeneous rare earth oxide fluoride systems of compositions RO(1+x)F(1-2x) with -0.1