ABSTRACT
III-V Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) with a gate stack based on high-kappa dielectric appears as an appealing solution to increase the performance of either microwave or logic circuits with low supply voltage (V(DD)). The main objective of this work is to provide a theoretical model of the gate charge control in III-V MOS capacitors (MOSCAPs) using the accurate self-consistent solution of 1D and 2D Poisson-Schrödinger equations. This study allows us to identify the major mechanisms which must be included to get theoretical calculations in good agreement with experiments. Actually, our results obtained for an Al2O3/In0.53Ga0.47As MOSCAP structure are successfully compared to experimental measurements. We evaluate how III-V MOS technology is affected by the density of interface states which favors the Fermi level pinning at the Al2O3/In0.53Ga0.47As interface in both depletion and inversion regimes, which is a consequence of the poor gate control of the mobile inversion carrier density. The high energy valleys (satellite valleys) contribution observed in many theoretical calculations appears to be fully negligible in the presence of interface states. The enhancement of doping density in the channel is shown to improve the short-channel effect (SCE) immunity but to the price of higher sensitivity to the interface trap effect which manifests through a low Fermi level movement efficiency at interface in OFF-state and a low inversion carrier density in ON-state, even in the long channel case.
