Link between T-Linear Resistivity and Quantum Criticality in Ambipolar Black Phosphorus.

The interplay between strong Coulomb interactions and kinetic energy leads to intricate many-body competing ground states owing to quantum fluctuations in 2D electron and hole gases. However, the simultaneous observation of quantum critical phenomena in both electron and hole regimes remains elusive. Here, we utilize anisotropic black phosphorus (BP) to show density-driven metal-insulator transition with a critical conductance ∼e2/h which highlights the significant role of quantum fluctuations in both hole and electron regimes. We observe a T-linear resistivity from the deep metallic phase to the metal-insulator boundary at moderate temperatures, while it turns to Fermi liquid behavior in the deep metallic phase at low temperatures in both regimes. An analysis of the resistivity suggests that disorder-dominated transport leads to T-linear behavior in the hole regime, while in the electron regime, the T-linear resistivity results from strong Coulomb interactions, suggestive of strange-metal behavior. Successful scaling collapse of the resistivity in the T-linear region demonstrates the link between quantum criticality and the T-linear resistivity in both regimes. Our study provides compelling evidence that ambipolar BP could serve as an exciting testbed for investigating exotic states and quantum critical phenomena in hole and electron regimes of 2D semiconductors.

Analysis of p-Type Doping in Graphene Induced by Monolayer-Oxidized TMDs.

Doping is one of the most difficult technological challenges for realizing reliable two-dimensional (2D) material-based semiconductor devices, arising from their ultrathinness. Here, we systematically investigate the impact of different types of nonstoichiometric solid MOx (M are W or Mo) dopants obtained by oxidizing transition metal dichalcogenides (TMDs: WSe2 or MoS2) formed on graphene FETs, which results in p-type doping along with disorders. From the results obtained in this study, we were able to suggest an analytical technique to optimize the optimal UV-ozone (UVO) treatment to achieve high p-type doping concentration in graphene FETs (∼2.5 × 1013 cm-2 in this study) without generating defects, mainly by analyzing the time dependency of D and D' peaks measured by Raman spectroscopy. Furthermore, an analysis of the structure of graphene sheets using TEM indicates that WOx plays a better protective role in graphene, compared to MoOx, suggesting that WOx is more effective for preventing the degradation of graphene during UVO treatment. To enhance the practical application aspect of our work, we have fabricated a graphene photodetector by selectively doping the graphene through oxidized TMDs, creating a p-n junction, which resulted in improved photoresponsivity compared to the intrinsic graphene device. Our results offer a practical guideline for the utilization of surface charge transfer doping of graphene toward CMOS applications.

Self-Aligned Top-Gate Structure in High-Performance 2D p-FETs via van der Waals Integration and Contact Spacer Doping.

The potential of 2D materials in future CMOS technology is hindered by the lack of high-performance p-type field effect transistors (p-FETs). While utilization of the top-gate (TG) structure with a p-doped spacer area offers a solution to this challenge, the design and device processing to form gate stacks pose serious challenges in realization of ideal p-FETs and PMOS inverters. This study presents a novel approach to address these challenges by fabricating lateral p+-p-p+ junction WSe2 FETs with self-aligned TG stacks in which desired junction is formed by van der Waals (vdW) integration and selective oxygen plasma-doping into spacer regions. The exceptional electrostatic controllability with a high on/off current ratio and small subthreshold swing (SS) of plasma doped p-FETs is achieved with the self-aligned metal/hBN gate stacks. To demonstrate the effectiveness of our approach, we construct a PMOS inverter using this device architecture, which exhibits a remarkably low power consumption of approximately 4.5 nW.

Doping-Free High-Performance Photovoltaic Effect in a WSe2 Lateral p-n Homojunction Formed by Contact Engineering.

Two-dimensional transition metal dichalcogenides (TMDs) are promising materials for semiconductor nanodevices owing to their flexibility, transparency, and appropriate band gaps. A variety of optoelectronic and electronic devices based on TMDs p-n diodes have been extensively investigated due to their unique advantages. However, improving their performance is challenging for commercial applications. In this study, we propose a facile and doping-free approach based on the contact engineering of a few-layer tungsten di-selenide to form a lateral p-n homojunction photovoltaic. By combining surface and edge contacts for p-n diode fabrication, the photovoltaic effect is achieved with a high fill factor of ≈0.64, a power conversion efficiency of up to ≈4.5%, and the highest external quantum efficiency with a value of ≈67.6%. The photoresponsivity reaches 283 mA/W, indicating excellent photodiode performance. These results demonstrate that our technique has great potential for application in next-generation optoelectronic devices.

Modulation of Contact Resistance of Dual-Gated MoS2 FETs Using Fermi-Level Pinning-Free Antimony Semi-Metal Contacts.

Achieving low contact resistance (RC ) is one of the major challenges in producing 2D FETs for future CMOS technology applications. In this work, the electrical characteristics for semimetal (Sb) and normal metal (Ti) contacted MoS2 devices are systematically analyzed as a function of top and bottom gate-voltages (VTG and VBG ). The semimetal contacts not only significantly reduce RC but also induce a strong dependence of RC on VTG , in sharp contrast to Ti contacts that only modulate RC by varying VBG . The anomalous behavior is attributed to the strongly modulated pseudo-junction resistance (Rjun ) by VTG , resulting from weak Fermi level pinning (FLP) of Sb contacts. In contrast, the resistances under both metallic contacts remain unchanged by VTG as metal screens the electric field from the applied VTG . Technology computer aided design simulations further confirm the contribution of VTG to Rjun , which improves overall RC of Sb-contacted MoS2 devices. Consequently, the Sb contact has a distinctive merit in dual-gated (DG) device structure, as it greatly reduces RC and enables effective gate control by both VBG and VTG . The results offer new insight into the development of DG 2D FETs with enhanced contact properties realized by using semimetals.

Percolation-Based Metal-Insulator Transition in Black Phosphorus Field Effect Transistors.

The existence of a novel phenomenon, such as the metal-insulator transition (MIT) in two-dimensional (2D) systems, affords emerging functional properties that provide new aspects for future electronics and optoelectronics. Here, we report the observation of the MIT in black phosphorus field effect transistors by tuning the carrier density (n) controlled by back-gate bias. We find that the conductivity follows an n dependence as σ(n) ∝ nα with α ∼ 1, which indicates the presence of screened Coulomb impurity scattering at high carrier densities in the temperature range of 10-300 K. As n decreases, the screened Coulomb impurity scattering breaks down, developing strong charge density inhomogeneity leading to a percolation-based transition at the critical carrier density (nC). At low carrier densities (n < nC), the system is in the insulating regime, which is expressed by Mott variable range hopping that demonstrates the role of disorder in the system. In addition, the extracted average values of critical exponent δ are ∼1.29 ± 0.01 and ∼1.14 ± 0.01 for devices A and B, respectively, consistent with the 2D percolation exponent of 4/3, confirming the 2D percolation-based MIT in BP devices. Our findings strongly suggest that the 2D MIT observed in BP is a classical percolation-based transition caused by charge inhomogeneity induced by screened Coulomb charge impurity scattering around a transition point controlled by n through back-gate bias.

Self-Forming p-n Junction Diode Realized with WSe2 Surface and Edge Dual Contacts.

Owing to their practical applications, two-dimensional semiconductor p-n diodes have attracted enormous attention. Over the past decade, various methods, such as chemical doping, heterojunction structures, and metallization using metals with different work functions, have been reported for fabrication of such devices. In this study, a lateral p-n junction diode is formed in tungsten diselenide (WSe2 ) using a combination of edge and surface contacts. The appearance of amorphous tungsten oxide at etched WSe2 , and the formation of a junction near the edge contact, are verified by high-resolution transmission electron microscopy. The device demonstrates high on/off ratio for both the edge and surface contacts, with respective values of 107 and 108 . The diode can achieve extremely high mobility of up to 168 cm2 V-1 s-1 and a rectification ratio of 103 . The ideality factor is 1.11 at a back gate voltage VG   = 60 V at 300 K. The devices with encapsulation of hexagonal boron nitride exhibit good stability to atmospheric exposure, over a measured period of 2 months. In addition, the architecture of the contacts, which is based on a single-channel device, should be advantageous for the implementation of more complicated applications such as inverters, photodetectors, and light-emitting diodes.

Selective Electron Beam Patterning of Oxygen-Doped WSe2 for Seamless Lateral Junction Transistors.

Surface charge transfer doping (SCTD) using oxygen plasma to form a p-type dopant oxide layer on transition metal dichalcogenide (TMDs) is a promising doping technique for 2D TMDs field-effect transistors (FETs). However, patternability of SCTD is a key challenge to effectively switch FETs. Herein, a simple method to selectively pattern degenerately p-type (p+ )-doped WSe2 FETs via electron beam (e-beam) irradiation is reported. The effect of the selective e-beam irradiation is confirmed by the gate-tunable optical responses of seamless lateral p+ -p diodes. The OFF state of the devices by inducing trapped charges via selective e-beam irradiation onto a desired channel area in p+ -doped WSe2 , which is in sharp contrast to globally p+ -doped WSe2 FETs, is realized. Selective e-beam irradiation of the PMMA-passivated p+ -WSe2 enables accurate control of the threshold voltage (Vth ) of WSe2 devices by varying the pattern size and e-beam dose, while preserving the low contact resistance. By utilizing hBN as the gate dielectric, high-performance WSe2 p-FETs with a saturation current of -280 µA µm-1 and on/off ratio of 109 are achieved. This study's technique demonstrates a facile approach to obtain high-performance TMD p-FETs by e-beam irradiation, enabling efficient switching and patternability toward various junction devices.

Recent Progress in 1D Contacts for 2D-Material-Based Devices.

Recent studies have intensively examined 2D materials (2DMs) as promising materials for use in future quantum devices due to their atomic thinness. However, a major limitation occurs when 2DMs are in contact with metals: a van der Waals (vdW) gap is generated at the 2DM-metal interfaces, which induces metal-induced gap states that are responsible for an uncontrollable Schottky barrier (SB), Fermi-level pinning (FLP), and high contact resistance (RC ), thereby substantially lowering the electronic mobility of 2DM-based devices. Here, vdW-gap-free 1D edge contact is reviewed for use in 2D devices with substantially suppressed carrier scattering of 2DMs with hexagonal boron nitride (hBN) encapsulation. The 1D contact further enables uniform carrier transport across multilayered 2DM channels, high-density transistor integration independent of scaling, and the fabrication of double-gate transistors suitable for demonstrating unique quantum phenomena of 2DMs. The existing 1D contact methods are reviewed first. As a promising technology toward the large-scale production of 2D devices, seamless lateral contacts are reviewed in detail. The electronic, optoelectronic, and quantum devices developed via 1D contacts are subsequently discussed. Finally, the challenges regarding the reliability of 1D contacts are addressed, followed by an outlook of 1D contact methods.