Direct In- and Out-of-Plane Writing of Metals on Insulators by Electron-Beam-Enabled, Confined Electrodeposition with Submicrometer Feature Size.

Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g., high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2 O3 , glass and flexible polyethylene, is demonstrated, enabled by electron-beam-induced reduction in a highly confined liquid electrolyte reservoir. The nanometer-size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells can offer greater flexibility toward deposition on arbitrary substrate geometries and materials. Installed in a low-vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.

Additive manufacturing of Zn with submicron resolution and its conversion into Zn/ZnO core-shell structures.

Electrohydrodynamic redox 3D printing (EHD-RP) is an additive manufacturing (AM) technique with submicron resolution and multi-metal capabilities, offering the possibility to switch chemistry during deposition "on-the-fly". Despite the potential for synthesizing a large range of metals by electrochemical small-scale AM techniques, to date, only Cu and Ag have been reproducibly deposited by EHD-RP. Here, we extend the materials palette available to EHD-RP by using aqueous solvents instead of organic solvents, as used previously. We demonstrate deposition of Cu and Zn from sacrificial anodes immersed in acidic aqueous solvents. Mass spectrometry indicates that the choice of the solvent is important to the deposition of pure Zn. Additionally, we show that the deposited Zn structures, 250 nm in width, can be partially converted into semiconducting ZnO structures by oxidation at 325 °C in air.

Composites of Copper Nanowires in Polyethylene: Preparation and Processing to Materials with NIR Dichroism.

Agglomeration of copper nanowires (aspect ratios on the order of 1000) in polyethylene, commonly a major problem, could be prevented by modification of the nanowires with a surface layer of oleylamine. Nanocomposite films were prepared by mixing nanowire dispersions in organic solvents with polyethylene solutions followed by casting, drying, and sometimes hot pressing. Orientation of the copper nanowires by solid-state drawing of the composites at elevated temperatures led to preferential alignment of the nanowires in the drawing direction. This arrangement gave rise to a uniform dichroism in the near-infrared (NIR) region, which is uncommon in the case of the hitherto reported dichroic nanocomposites. The NIR dichroism is ascribed to the high aspect ratio of the metal wires. Hence, drawing of isotropic nanocomposites with metal wires may serve for the manufacture of NIR polarization filters.