Bioplastics and Carbon-Based Sustainable Materials, Components, and Devices: Toward Green Electronics.

The continuously growing number of short-life electronics equipment inherently results in a massive amount of problematic waste, which poses risks of environmental pollution, endangers human health, and causes socioeconomic problems. Hence, to mitigate these negative impacts, it is our common interest to substitute conventional materials (polymers and metals) used in electronics devices with their environmentally benign renewable counterparts, wherever possible, while considering the aspects of functionality, manufacturability, and cost. To support such an effort, in this study, we explore the use of biodegradable bioplastics, such as polylactic acid (PLA), its blends with polyhydroxybutyrate (PHB) and composites with pyrolyzed lignin (PL), and multiwalled carbon nanotubes (MWCNTs), in conjunction with processes typical in the fabrication of electronics components, including plasma treatment, dip coating, inkjet and screen printing, as well as hot mixing, extrusion, and molding. We show that after a short argon plasma treatment of the surface of hot-blown PLA-PHB blend films, percolating networks of single-walled carbon nanotubes (SWCNTs) having sheet resistance well below 1 kΩ/□ can be deposited by dip coating to make electrode plates of capacitive touch sensors. We also demonstrate that the bioplastic films, as flexible dielectric substrates, are suitable for depositing conductive micropatterns of SWCNTs and Ag (1 kΩ/□ and 1 Ω/□, respectively) by means of inkjet and screen printing, with potential in printed circuit board applications. In addition, we exemplify compounded and molded composites of PLA with PL and MWCNTs as excellent candidates for electromagnetic interference shielding materials in the K-band radio frequencies (18.0-26.5 GHz) with shielding effectiveness of up to 40 and 46 dB, respectively.

Ultra-low permittivity porous silica-cellulose nanocomposite substrates for 6G telecommunication.

The continuously increasing demand for faster data traffic of our telecommunication devices requires new and better materials and devices that operate at higher frequencies than today. In this work, a porous composite of silica nanoshells and cellulose nanofibers is demonstrated as a suitable candidate of dielectric substrates to be used in future 6G frequency bands. The hollow nanospheres of amorphous SiO2 with outstanding electromagnetic properties were obtained by a template-assisted Stöber process, in which a thin shell of silica is grown on polystyrene nanospheres first, and then the polymer core is burned off in a subsequent step. To be able to produce substrates with sufficient mechanical integrity, the nanoshells of SiO2 were reinforced with cellulose nanofibers resulting in a porous composite of very low mass density (0.19 ± 0.02 g cm-3), which is easy to press and mold to form films or slabs. The low relative dielectric permittivity (ε r = 1.19 ± 0.01 at 300 GHz and ε r = 1.17 ± 0.01 at 2.0 THz) and corresponding loss tangent (tan δ= 0.011 ± 0.001 at 300 GHz and tan δ = 0.011 ± 0.001 at 2.0 THz) of the composite films are exploited in substrates for radio frequency filter structures designed for 300 GHz operation.