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1.
Polymers (Basel) ; 15(19)2023 Sep 25.
Article in English | MEDLINE | ID: mdl-37835930

ABSTRACT

The concept of the circular economy has emerged as a promising solution to address the mounting concerns surrounding plastic waste and the urgent need for sustainable resource management. While conventional centralized recycling remains a common practice for plastic waste, centralized facilities may prove inadequate in handling the ever-increasing volumes of plastic waste generated globally. Consequently, exploring alternative recycling methods, such as distributed recycling by additive manufacturing, becomes paramount. This innovative approach encompasses actively involving communities in recycling practices and promotes a circular economy. This comprehensive review paper aims to explore the critical aspects necessary to realize the potential of distributed recycling by additive manufacturing. In this paper, our focus lies on proposing schemes that leverage existing literature to harness the potential of distributed recycling by additive manufacturing as an effective approach to plastic waste management. We explore the intricacies of the recycling process, optimize 3D printing parameters, address potential challenges, and evaluate the mechanical properties of recycled materials. Our investigation draws heavily from the literature of the last five years, as we conduct a thorough critical assessment of DRAM implementation and its influence on the properties of 3D printing structures. Through comprehensive analysis, we reveal the potential of recycled materials in delivering functional components, with insights into their performance, strengths, and weaknesses. This review serves as a comprehensive guide for those interested in embracing distributed recycling by additive manufacturing as a transformative approach to plastic recycling. By fostering community engagement, optimizing 3D printing processes, and incorporating suitable additives, it is possible to collectively contribute to a more sustainable future while combatting the plastic waste crisis. As progress is made, it becomes essential to further delve into the complexities of material behavior, recycling techniques, and the long-term durability of recycled 3D printed components. By addressing these challenges head-on, it is feasible to refine and advance distributed recycling by additive manufacturing as a viable pathway to minimize plastic waste, fostering a circular economy and cultivating a cleaner planet for generations to come.

2.
ACS Nano ; 14(12): 17262-17272, 2020 Dec 22.
Article in English | MEDLINE | ID: mdl-33216539

ABSTRACT

There is an increasing interest in additive nanomanufacturing processes, which enable customizable patterning of functional materials and devices on a wide range of substrates. However, there are relatively few techniques with the ability to directly 3D print patterns of functional materials with sub-micron resolution. In this study, we demonstrate the use of additive electrohydrodynamic jet (e-jet) printing with an average line width of 312 nm, which acts as an inhibitor for area-selective atomic layer deposition (AS-ALD) of a range of metal oxides. We also demonstrate subtractive e-jet printing with solvent inks that dissolve polymer inhibitor layers in specific regions, which enables localized AS-ALD within those regions. The chemical selectivity and morphology of e-jet patterned polymers towards binary and ternary oxides of ZnO, Al2O3, and SnO2 were quantified using X-ray photoelectron spectroscopy, atomic force microscopy, and Auger electron spectroscopy. This approach enables patterning of functional oxide semiconductors, insulators, and transparent conducting oxides with tunable composition, Å-scale control of thickness, and sub-µm resolution in the x-y plane. Using a combination of additive and subtractive e-jet printing with AS-ALD, a thin-film transistor was fabricated using zinc-tin-oxide for the semiconductor channel and aluminum-doped zinc oxide as the source and drain electrical contacts. In the future, this technique can be used to print integrated electronics with sub-micron resolution on a variety of substrates.

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