ABSTRACT
The aim of the research was to characterize the soldering alloy type Zn-Mg-Sr and direct the soldering of SiC ceramics with Cu-SiC-based composite. It was investigated whether the proposed composition of the soldering alloy was appropriate for soldering those materials at the defined conditions. For the determination of the solder melting point, TG/DTA analysis was applied. The Zn-Mg system is of the eutectic type with a reaction temperature of 364 °C. The effect of strontium on the phase transformation was minimal, owing to its lower content. The microstructure of the soldering alloy type Zn3Mg1.5Sr is formed of a very fine eutectic matrix containing segregated phases of strontium-SrZn13 and magnesium-MgZn2 and Mg2Zn11. The average tensile strength of the solder is 98.6 MPa. The tensile strength was partially increased by solder alloying with magnesium and strontium. The SiC/solder joint was formed due to the distribution of magnesium from the solder to the boundary with the ceramics at the formation of a phase. Owing to soldering in air, oxidation of the magnesium took place and the oxides formed were combined with the silicon oxides that remained on the surface of the ceramic material-SiC. Thus, a strong bond based on oxygen was obtained. An interaction between the liquid zinc solder and the copper matrix of the composite substrate took place at the formation of a new phase-γCu (Cu5Zn8). The shear strength was measured on several ceramic materials. The average shear strength of the combined SiC/Cu-SiC joint fabricated with Zn3Mg1.5Sr solder was 62 MPa. When soldering similar ceramic materials mutually, a shear strength of as much as around 100 MPa was observed.
ABSTRACT
This research aimed to study a Bi-Ag-Mg soldering alloy and the direct soldering of Al2O3 ceramics and Ni-SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al2O3/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 µm. The bond at the boundary of the Bi11Ag1Mg/Ni-SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi3 phase. The average shear strength of the combined Al2O3/Ni-SiC joint with Bi11Ag1Mg solder is 27 MPa.
ABSTRACT
In the present work, the microstructure, phase constitution, and corrosion behavior of binary Sn-xZn alloys (x = 5, 9 and 15 wt.%) were investigated. The alloys were prepared by induction melting of Sn and Zn lumps in argon. After melting, the alloys were solidified to form cast cylinders. The Sn-9Zn alloy had a eutectic microstructure. The Sn-5Zn and Sn-15Zn alloys were composed of dendritic (Sn) or (Zn) and eutectic. The corrosion behavior of the Sn-Zn alloys was studied in aqueous HCl (1 wt.%) and NaCl (3.5 wt.%) solutions at room temperature. Corrosion potentials and corrosion rates in HCl were significantly higher compared to NaCl. The corrosion of the binary Sn-Zn alloys was found to take place by a galvanic mechanism. The chemical composition of the corrosion products formed on the Sn-Zn alloys changed with the Zn weight fraction. Alloys with a higher concentration of Zn (Sn-9Zn, Sn-15Zn) formed corrosion products rich in Zn. The Zn-rich corrosion products were prone to spallation. The corrosion rate in the HCl solution decreased with decreasing weight fraction of Zn. The Sn-5Zn alloy had the lowest corrosion rate. The corrosion resistance in HCl could be considerably improved by reducing the proportion of zinc in Sn-Zn alloys.
ABSTRACT
The aim of this research was to characterize soldering alloys of the type Sn-Sb-Ti and to study the ultrasonic soldering of SiC ceramics with a metal-ceramic composite of the type Cu-SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti6(Sb,Sn)5 phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)6(Sb,Sn)5 reaction product. The bond with the metal-ceramic composite Cu-SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable ε-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu-SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn-Sb-Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.
ABSTRACT
The strain behavior of SiC/Stycast 2850 FT composites under thermomechanical loading using a finite element analysis (FEA) was studied. These composites can serve as thermal stabilizers of high-temperature superconducting (HTS) tapes during limitation event in resistive superconducting fault current limiter (R-SCFCL) applications. For this purpose, the thermomechanical properties of four composite systems with different filler content were studied experimentally. The FEA was calculated using an ANSYS software and it delivered useful information about the strain distribution in the composite coating, as well as in particular layers of the modified HTS tapes. The tapes were subjected to bending over a 25 cm core, cooled in a liquid nitrogen (LN2) bath, and finally, quenched from this temperature to various temperatures up to 150 °C for a very short time, simulating real limitation conditions. The outputs from simulations were also correlated with the experiments. The most promising of all investigated systems was SB11-SiC20 composite in form of 100 µm thick coating, withstanding a temperature change from LN2 up to 120 °C.
