ABSTRACT
A popular soldering technique for printed circuit boards (PCB) is the so-called surface-mounted technology. After the soldering process an automated optical inspection (AOI) is the common method determining whether a PCB shall go to a manual inspection and rework station (MIS) or can directly go further to the next process step. Thereby, the AOI is a vision-based system deriving user defined physical measurements from a camera image. Based on these pre-defined measurements associated with static specification limits, the AOI labels each inspected soldering spot on a PCB as non-defect or defect. However, a large majority of PCBs are wrongly labelled defect, so-called false calls, causing a major manual labour effort at the MIS. This dataset contains a 132-days recording of PCBs going through the MIS labelled as true defect or false call with the physical measurement by the AOI. Furthermore, the dataset may contain various distribution drifts of unknown type that can be explained by the high sensitivity of electronic production to small external factors that may change unrecognized and additionally the dataset has an unknown percentage of label error due the human labelling process.
