ABSTRACT
In microelectronics, recently developed 3D integration offers the possibility to stack the dice or wafers vertically instead of putting their different parts next to one another, in order to save space. As this method becomes of greater interest, the need for 3D imaging techniques becomes higher. We here report a study about different 3D characterization techniques applied to copper pillars, which are used to stack different dice together. Destructive techniques such as FIB/SEM, FIB/FIB, and PFIB/PFIB slice and view protocols have been assessed, as well as non-destructive ones, such as laboratory-based and synchrotron-based computed tomographies. A comparison of those techniques in the specific case of copper pillars is given, taking into account the constraints linked to the microelectronics industry, mainly concerning resolution and sample throughput. Laboratory-based imaging techniques are shown to be relevant in the case of punctual analyses, while synchrotron based tomographies offer highly resolved volumes for larger batches of samples.
ABSTRACT
Spintronics materials have recently been considered for radio-frequency devices such as oscillators by exploiting the transfer of spin angular momentum between a spin-polarized electrical current and the magnetic nanostructure it passes through. While previous spin-transfer oscillators (STOs) were based on in-plane magnetized structures, here we present the realization of an STO that contains a perpendicular spin current polarizer combined with an in-plane magnetized free layer. This device is characterized by high-frequency oscillations of the free-layer magnetization, consistent with out-of-plane steady-state precessions induced at the threshold current by a spin-transfer torque from perpendicularly polarized electrons. The results are summarized in static and dynamic current-field state diagrams and will be of importance for the design of STOs with enhanced output signals.
