ABSTRACT
Structural health monitoring systems for composite laminates using guided ultrasonic waves become more versatile with the structural integration of sensors. However, the data generated within these sensors have to be transmitted from the laminate to the outside, where polyimide-based printed circuit boards play a major role. This study investigates, to what extent integrated polyimide inlays with applied sensor bodies influence the guided ultrasonic wave propagation in glass fiber-reinforced polymer specimens. For reasons of resource efficiency, narrow specimens are used. Numerical simulations of a damping-free specimen indicate reflections of the S0-mode at the integrated inlay. This is validated experimentally with an air-coupled ultrasonic technique and a 3D laser Doppler vibrometry measurement. The experimental data are evaluated with a method including temporal and spatial continuous wavelet transformations to clearly identify periodically occurring wave packages as edge reflections and distinguish them from possible inlay reflections. However, even when separating in-plane and out-of-plane movements using the 3D measurement, no reflections at the inlays are detected. This leads to the conclusion that polyimide inlays are well suited as substrates for printed circuit boards integrated into fiber-reinforced polymer structures for structural health monitoring, since they do not significantly influence the wave propagation.
ABSTRACT
Structural health monitoring of lightweight constructions made of composite materials can be performed using guided ultrasonic waves. If modern fiber metal laminates are used, this requires integrated sensors that can record the inner displacement oscillations caused by the propagating guided ultrasonic waves. Therefore, we developed a robust MEMS vibrometer that can be integrated while maintaining the structural and functional compliance of the laminate. This vibrometer is directly sensitive to the high-frequency displacements from structure-borne ultrasound when excited in a frequency range between its first and second eigenfrequency. The vibrometer is mostly realized by processes earlier developed for a pressure sensor but with additional femtosecond laser ablation and encapsulation. The piezoresistive transducer, made from silicon, is encapsulated between top and bottom glass lids. The eigenfrequencies are experimentally determined using an optical micro vibrometer setup. The MEMS vibrometer functionality and usability for structural health monitoring are demonstrated on a customized test rig by recording application-relevant guided ultrasonic wave packages with a central frequency of 100 kHz at a distance of 0.2 m from the exciting ultrasound transducer.
