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1.
ACS Appl Mater Interfaces ; 12(14): 16639-16647, 2020 Apr 08.
Article in English | MEDLINE | ID: mdl-32223206

ABSTRACT

Niobium oxide (NbOx) materials of various compositions are of interest for neuromorphic systems that rely on memristive device behavior. In this study, we vary the composition of NbOx thin films deposited via atomic layer deposition (ALD) by incorporating one or more in situ hydrogen plasma exposure steps during the ALD supercycle. Films with compositions ranging from Nb2O5 to NbO2 were deposited, with film composition dependent on the duration of the plasma exposure step, the number of plasma exposure steps per ALD supercycle, and the hydrogen content of the plasma. The chemical and optical properties of the ALD NbOx films were probed using spectral ellipsometry, X-ray photoelectron spectroscopy, and optical transmission spectroscopy. Two-terminal electrical devices fabricated from ALD Nb2O5 and NbO2 thin films exhibited memristive switching behavior, with switching in the NbO2 devices achieved without a high-field electroforming step. The ability to controllably tune the composition of ALD-grown NbOx films opens new opportunities for realizing a variety of device structures relevant for neuromorphic computing and other emerging electronic and optoelectronic applications.

2.
ACS Appl Mater Interfaces ; 7(28): 15200-5, 2015 Jul 22.
Article in English | MEDLINE | ID: mdl-26090544

ABSTRACT

Hexagonal boron nitride (h-BN) is an important material for the development of new 2D heterostructures. To enable this development, the relationship between crystal growth and the substrate orientation must be explored and understood. In this study, we simultaneously grew h-BN on different orientations of Cu substrates to establish the impact of substrate structure on the growth habit of thin h-BN layers. The substrates studied were a polycrystalline Cu foil, Cu(100), Cu(110), and Cu(111). Fourier transform grazing-incidence infrared reflection absorption spectroscopy (FT-IRRAS) was used to identify h-BN on copper substrates. X-ray photoelectron spectroscopy (XPS) was used to determine the effective thickness of the h-BN. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) were used to measure the morphology of the films and postgrowth crystal structure of the Cu substrates, respectively. Combining the SEM and EBSD images allowed for the correlation between h-BN film coverage and the crystal structure of Cu. It was found that the growth rate was inversely proportional to the surface free energy of the Cu surface, with Cu(111) having the most h-BN surface coverage. The Cu foil predominately crystallized with a (100) surface orientation, and likewise had a film coverage very close to the Cu(100).

3.
Nanoscale ; 7(8): 3694-702, 2015 Feb 28.
Article in English | MEDLINE | ID: mdl-25640166

ABSTRACT

Atomically thin two dimensional hexagonal boron nitride (2D h-BN) is one of the key materials in the development of new van der Waals heterostructures due to its outstanding properties including an atomically smooth surface, high thermal conductivity, high mechanical strength, chemical inertness and high electrical resistance. The development of 2D h-BN growth is still in the early stages and largely depends on rapid and accurate characterization of the grown monolayer or few layers h-BN films. This paper demonstrates a new approach to characterizing monolayer h-BN films directly on metal substrates by grazing-incidence infrared reflection absorption spectroscopy (IRRAS). Using h-BN films grown by atmospheric-pressure chemical vapor deposition on Cu and Ni substrates, two new sub-bands are found for the A2u out-of-plane stretching mode. It is shown, using both experimental and computational methods, that the lower-energy sub-band is related to 2D h-BN coupled with substrate, while the higher energy sub-band is related to decoupled (or free-standing) 2D h-BN. It is further shown that this newly-observed fine structure in the A2u mode can be used to assess, quickly and easily, the homogeneity of the h-BN-metal interface and the effects of metal surface contamination on adhesion of the layer.

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