Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.

Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications. The realized specimens are characterized by low resistance (median 21 mΩ), linear voltage-current characteristics, and fluid-resistant encapsulation. The contact area is comprehensively analyzed and compared with the theoretical Holm's model.

A Comprehensive Study of Polyurethane Potting Compounds Doped with Magnesium Oxide Nanoparticles.

Recently, polyurethanes (PURs) have become a very promising group of materials with considerable utilization and innovation potential. This work presents a comprehensive analysis of the changes in material properties important for PUR applications in the electrical industry due to the incorporation of magnesium oxide (MgO) nanoparticles at different weight ratios. From the results of the investigations carried out, it is evident that the incorporation of MgO improves the volume (by up to +0.5 order of magnitude) and surface (+1 order of magnitude) resistivities, reduces the dielectric losses at higher temperatures (-62%), improves the thermal stability of the material, and slows the decomposition reaction of polyurethane at specific temperatures (+30 °C). In contrast, the incorporation of MgO results in a slight decrease in the dielectric strength (-15%) and a significant decrease in the mechanical strength (-37%).

Electrical Contact Resistance of Large-Area Graphene on Pre-Patterned Cu and Au Electrodes.

Contact resistance between electrically connected parts of electronic elements can negatively affect their resulting properties and parameters. The contact resistance is influenced by the physicochemical properties of the connected elements and, in most cases, the lowest possible value is required. The issue of contact resistance is also addressed in connection with the increasingly frequently used carbon allotropes. This work aimed to determine the factors that influence contact resistance between graphene prepared by chemical vapour deposition and pre-patterned Cu and Au electrodes onto which graphene is subsequently transferred. It was found that electrode surface treatment methods affect the resistance between Cu and graphene, where contact resistance varied greatly, with an average of 1.25 ± 1.54 kΩ, whereas for the Au electrodes, the deposition techniques did not influence the resulting contact resistance, which decreased by almost two orders of magnitude compared with the Cu electrodes, to 0.03 ± 0.01 kΩ.