Micromachining of Alumina Using a High-Power Ultrashort-Pulsed Laser.

We report on a comprehensive study of laser ablation and micromachining of alumina using a high-power 1030 nm ultrashort-pulsed laser. By varying laser power up to 150 W, pulse duration between 900 fs and 10 ps, repetition rates between 200 kHz and 800 kHz), spatial pulse overlap between 70% and 80% and a layer-wise rotation of the scan direction, the ablation efficiency, ablation rate and surface roughness are determined and discussed with respect to an efficient and optimized process strategy. As a result, the combination of a high pulse repetition rate of 800 kHz and the longest evaluated pulse duration of 10 ps leads to the highest ablation efficiency of 0.76 mm3/(W*min). However, the highest ablation rate of up to 57 mm3/min is achieved at a smaller repetition rate of 200 kHz and the shortest evaluated pulse duration of 900 fs. The surface roughness is predominantly affected by the applied laser fluence. The application of a high repetition rate leads to a small surface roughness Ra below 2 µm even for the usage of 150 W laser power. By an interlayer rotation of the scan path, optimization of the ablation characteristics can be achieved, while an interlayer rotation of 90° leads to increasing the ablation rate, the application of a rotation angle of 11° minimizes the surface roughness. The evaluation by scanning electron microscopy shows the formation of thin melt films on the surface but also reveals a minimized heat affected zone for the in-depth modification. Overall, the results of this study pave the way for high-power ultrashort-pulsed lasers to efficient, high-quality micromachining of ceramics.

Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials.

We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit board material using ultrashort pulse lasers with emission in the green spectral region. Laser pulse durations in the pico- and femtosecond regime, laser pulse repetition rates up to 400 kHz and laser fluences up to 11.5 J/cm2 are applied to optimize the quality of microvias, as being evaluated by the generated taper, the extension of glass fiber protrusions and damage of inner lying copper layers using materialography. The results are discussed in terms of the ablation threshold for FR-4 and copper, heat accumulation and pulse shielding effects as a result of pulse to pulse interactions. As a specific result, using a laser pulse duration of 2 ps appears beneficial, resulting in small glass fiber protrusions and high precision in the stopping process at inner copper layer. If laser pulse repetition rates larger than 100 kHz are applied, we find that the processing quality can be increased by heat accumulation effects.

Ultrashort pulsed laser backside ablation of fused silica.

We report on the fabrication of rectangular microchannels with vertical sidewalls in fused silica by laser backside ablation. A 515 nm femtosecond laser is focused by an objective with a NA of 0.5 through the sample on the glass/air interface, allowing processing from the backside into the bulk material. Experimental investigations reveal a logarithmically increasing depth of the channels with an increasing number of scans, while keeping the focal position fixed. A certain number of scans has to be applied to generate rectangular shaped channels while their depth can be controlled by the applied fluence from 2.64 µm to 13.46 µm and a corresponding ablation roughness Ra between 0.20 µm and 0.33 µm. The channel width can be set directly via the number of parallel ablated lines demonstrated in a range from 10 µm to 50 µm. By adjusting the focal position after each scan the channel depth can be extended to 49.77 µm while maintaining a rectangular channel geometry. Finally, concentric rings are ablated to demonstrate the flexibility of the direct writing process.

Enhanced ablation efficiency using GHz bursts in micromachining fused silica.

We report on micromilling cavities into fused silica by a 1030 nm femtosecond laser using 2.17 GHz bursts. The milled cavities show an increased depth per layer for a higher number of pulses per burst while the ablation efficiency is also increased. The maximum ablation efficiency for the optimum fluence achieved in our experiments is 3.05mm3/min/W for a burst number of 10, which is 7.4 times higher than for the non-burst condition (0.41mm3/min/W). Furthermore, the ablation threshold for each sub-pulse is significantly reduced from 0.64J/cm2 for the non-burst condition to 0.15J/cm2 for 10 bursts. Beside the ablation efficiency, the surface roughness is also increased with the increasing burst number, while two ablation behaviors can be distinguished, namely, a gentle ablation regime for lower burst numbers and a coarse ablation regime, dominated by breaking out the surface rather than ablating it.

Fabrication and evaluation of negative axicons for ultrashort pulsed laser applications.

We report on the fabrication and evaluation of a sharp tip negative axicon paving the way for applications in high-power ultrashort pulsed laser systems. The negative axicon is manufactured by applying a two-step all laser-based process chain consisting of ultrashort pulsed laser ablation and CO2 laser polishing finishing the component in less than 5 minutes. The finalized negative axicon reveals a surface roughness of 18 nm, fulfilling optical quality. Two measurement setups, including the ultrashort pulsed laser itself, are used to evaluate the formation of Bessel beams in detail. By applying a focusing lens behind the negative axicon, well-developed Bessel beams are generated while their lengths depend on the distance between the negative axicon and the lens. Furthermore, the diameter of the Bessel beams increase strongly with the propagation distance. By adding a second focusing lens, Bessel beams are generated at its focal position, being almost invariant of its position. Hence, the typical Bessel beam intensity distribution is observed over an entire moving range of this second lens of 300 mm. While these Bessel beams show superior quality in terms of sharp peaks with homogeneous concentric rings, only minor deviations in intensity and diameter are observed over the moving range.

Laser-fabricated axicons challenging the conventional optics in glass processing applications.

Laser-based fabrication can be an alternative technology to mechanical grinding and polishing processes. However, the performance of these elements in real applications still needs to be validated. In this paper, we demonstrate that the subtractive fabrication technology is able to produce high-quality axicons from fused silica, which can be efficiently used for glass processing. We comprehensively investigate axicons, fabricated by ultrashort pulsed laser ablation with subsequent CO2 laser polishing, and compare their performance with commercially available axicons. We show that laser-fabricated axicons are comparable in quality with a precision commercial axicon. Furthermore, we demonstrate the intra-volume glass modification and dicing, utilising mJ-level laser pulses. We show that the tilting operation of the laser-fabricated axicons results in the formation of directional transverse cracks, which significantly enhance the 1 mm-thick glass dicing process.

Microchannels inside bulk PMMA generated by femtosecond laser using adaptive beam shaping.

In this contribution, we report on the generation of internal microchannels with basically unlimited channel length inside of PMMA bulk material by femtosecond laser. A precisely controllable and stable circular channel cross section is obtained by using a spatial light modulator to compensate the writing depth depending spherical aberration. Furthermore, the generation of a rotatable elliptical input beam by adaptive optics ensures a fitting of the beam shaping to the writing direction. In this study, we report on both, the effect of the ellipticity of the input beam and the effect of a correction of the spherical aberration on the circularity of the resulting internal microchannels. Moreover, we demonstrate the application of this writing technique by creating microfluidic testing structures inside of a transparent standard polymer.

Fabrication of a high-quality axicon by femtosecond laser ablation and CO2 laser polishing for quasi-Bessel beam generation.

We report on the fabrication of an axicon by applying a two-step manufacturing process including a 1030 nm femtosecond and a 10.6 µm CO2 laser. First, the pre-defined axicon geometry is generated by high-precision femtosecond layer-by-layer ablation. In order to meet high surface quality requirements, inevitable stipulated for optical use, the surface of the thus structured axicon is smoothened by a subsequent CO2 laser polishing process. The finalized axicon fulfills optical quality as the surface roughness Ra is significantly reduced from 0.56 µm to 34 nm. For the evaluation of the optical quality, the axicon is placed in a measurement setup including the femtosecond laser. Comparison between the calculated Bessel beam for an ideal axicon and the quasi-Bessel beam generated and measured by the fabricated axicon reveals excellent agreement, verifying our precise manufacturing method.