Ultrasoft microwire neural electrodes improve chronic tissue integration.

Chronically implanted neural multi-electrode arrays (MEA) are an essential technology for recording electrical signals from neurons and/or modulating neural activity through stimulation. However, current MEAs, regardless of the type, elicit an inflammatory response that ultimately leads to device failure. Traditionally, rigid materials like tungsten and silicon have been employed to interface with the relatively soft neural tissue. The large stiffness mismatch is thought to exacerbate the inflammatory response. In order to minimize the disparity between the device and the brain, we fabricated novel ultrasoft electrodes consisting of elastomers and conducting polymers with mechanical properties much more similar to those of brain tissue than previous neural implants. In this study, these ultrasoft microelectrodes were inserted and released using a stainless steel shuttle with polyethyleneglycol (PEG) glue. The implanted microwires showed functionality in acute neural stimulation. When implanted for 1 or 8weeks, the novel soft implants demonstrated significantly reduced inflammatory tissue response at week 8 compared to tungsten wires of similar dimension and surface chemistry. Furthermore, a higher degree of cell body distortion was found next to the tungsten implants compared to the polymer implants. Our results support the use of these novel ultrasoft electrodes for long term neural implants. STATEMENT OF SIGNIFICANCE: One critical challenge to the translation of neural recording/stimulation electrode technology to clinically viable devices for brain computer interface (BCI) or deep brain stimulation (DBS) applications is the chronic degradation of device performance due to the inflammatory tissue reaction. While many hypothesize that soft and flexible devices elicit reduced inflammatory tissue responses, there has yet to be a rigorous comparison between soft and stiff implants. We have developed an ultra-soft microelectrode with Young's modulus lower than 1MPa, closely mimicking the brain tissue modulus. Here, we present a rigorous histological comparison of this novel ultrasoft electrode and conventional stiff electrode with the same size, shape and surface chemistry, implanted in rat brains for 1-week and 8-weeks. Significant improvement was observed for ultrasoft electrodes, including inflammatory tissue reaction, electrode-tissue integration as well as mechanical disturbance to nearby neurons. A full spectrum of new techniques were developed in this study, from insertion shuttle to in situ sectioning of the microelectrode to automated cell shape analysis, all of which should contribute new methods to the field. Finally, we showed the electrical functionality of the ultrasoft electrode, demonstrating the potential of flexible neural implant devices for future research and clinical use.

Elastomeric and soft conducting microwires for implantable neural interfaces.

Current designs for microelectrodes used for interfacing with the nervous system elicit a characteristic inflammatory response that leads to scar tissue encapsulation, electrical insulation of the electrode from the tissue and ultimately failure. Traditionally, relatively stiff materials like tungsten and silicon are employed which have mechanical properties several orders of magnitude different from neural tissue. This mechanical mismatch is thought to be a major cause of chronic inflammation and degeneration around the device. In an effort to minimize the disparity between neural interface devices and the brain, novel soft electrodes consisting of elastomers and intrinsically conducting polymers were fabricated. The physical, mechanical and electrochemical properties of these materials were extensively characterized to identify the formulations with the optimal combination of parameters including Young's modulus, elongation at break, ultimate tensile strength, conductivity, impedance and surface charge injection. Our final electrode has a Young's modulus of 974 kPa which is five orders of magnitude lower than tungsten and significantly lower than other polymer-based neural electrode materials. In vitro cell culture experiments demonstrated the favorable interaction between these soft materials and neurons, astrocytes and microglia, with higher neuronal attachment and a two-fold reduction in inflammatory microglia attachment on soft devices compared to stiff controls. Surface immobilization of neuronal adhesion proteins on these microwires further improved the cellular response. Finally, in vivo electrophysiology demonstrated the functionality of the elastomeric electrodes in recording single unit activity in the rodent visual cortex. The results presented provide initial evidence in support of the use of soft materials in neural interface applications.

Substituted polypyridine complexes of cobalt(II/III) as efficient electron-transfer mediators in dye-sensitized solar cells.

A number of cobalt complexes of substituted polypyridine ligands were synthesized and investigated as possible alternatives to the volatile and corrosive iodide/triiodide redox couple commonly used as an electron-transfer mediator in dye-sensitized solar cells (DSSCs). The extinction coefficients in the visible spectrum are on the order of 10(2) M(-1) cm(-1) for the majority of these complexes, diminishing competition with the light-harvesting dye. Cyclic voltammetric studies revealed a dramatic surface dependence of the heterogeneous electron-transfer rate, which is surprisingly different for gold, carbon, and platinum electrodes. DSSCs were assembled using a mediator that consisted of a mixture of Co(II) and Co(III) complexes in a 10:1 ratio. DSSCs containing these mediators were used to characterize incident photon-to-current conversion efficiency and photoelectrochemical responses. The best performing of these mediators were identified and subjected to further study. As suggested by electrochemical results, gold and carbon are superior cathode materials to platinum, and no evidence of corrosion on any cathode material was observed. Addition of lithium salts to the mediator solution resulted in a dramatic improvement in cell performance. The observed Li(+) effect is explained in terms of the recombination of injected electrons in the photoanode with the oxidized mediator. The best mediator, based on tris(4,4'-di-tert-butyl-2,2'-dipyridyl)cobalt(II/III) perchlorate, resulted in DSSCs exhibiting efficiencies within 80% of that of a comparable iodide/triiodide-mediated DSSC. Due to the commercial availability of the ligand and the simplicity with which the complex can be made, this new mediator represents a nonvolatile, noncorrosive, and practical alternative as an efficient electron-transfer mediator in DSSCs.