ABSTRACT
Microelectronic components are used in a variety of applications that range from processing units to smart devices. These components are prone to malfunctions at high temperatures exceeding 373 K in the form of heat dissipation. To resolve this issue, in microelectronic components, a cooling system is required. This issue can be better dealt with by using a combination of metal foam, heat sinks, and nanofluids. This study investigates the effect of using a rectangular-finned heat sink integrated with metal foam between the fins, and different water-based nanofluids as the working fluid for cooling purposes. A 3D numerical model of the metal foam with a BCC-unit cell structure is used. Various parameters are analyzed: temperature, pressure drop, overall heat transfer coefficient, Nusselt number, and flow rate. Fluid flows through the metal foam in a turbulent flow with a Reynold's number ranging from 2100 to 6500. The optimum fin height, thickness, spacing, and base thickness for the heat sink are analyzed, and for the metal foam, the material, porosity, and pore density are investigated. In addition, the volume fraction, nanoparticle material, and flow rate for the nanofluid is obtained. The results showed that the use of metal foam enhanced the thermal performance of the heat sink, and nanofluids provided better thermal management than pure water. For both cases, a higher Nusselt number, overall heat transfer coefficient, and better temperature reduction is achieved. CuO nanofluid and high-porosity low-pore-density metal foam provided the optimum results, namely a base temperature of 314 K, compared to 341 K, with a pressure drop of 130 Pa. A trade-off was achieved between the temperature reduction and pumping power, as higher concentrations of nanofluid provided better thermal management and resulted in a large pressure drop.
ABSTRACT
The versatile one-pot green synthesis of a highly concentrated and stable colloidal dispersion of silver nanoparticles (Ag NPs) was carried out using the self-assembled tannic acid without using any other hazardous chemicals. Tannic acid (Plant-based polyphenol) was used as a reducing and stabilizing agent for silver nitrate in a mild alkaline condition. The synthesized Ag NPs were characterized for their concentration, capping, size distribution, and shape. The experimental results confirmed the successful synthesis of nearly spherical and highly concentrated (2281 ppm) Ag NPs, capped with poly-tannic acid (Ag NPs-PTA). The average particle size of Ag NPs-PTA was found to be 9.90 ± 1.60 nm. The colloidal dispersion of synthesized nanoparticles was observed to be stable for more than 15 months in the ambient environment (25 °C, 65% relative humidity). The synthesized AgNPs-PTA showed an effective antimicrobial activity against Staphylococcus Aureus (ZOI 3.0 mM) and Escherichia coli (ZOI 3.5 mM). Ag NPs-PTA also exhibited enhanced catalytic properties. It reduces 4-nitrophenol into 4-aminophenol in the presence of NaBH4 with a normalized rate constant (Knor = K/m) of 615.04 mL·s-1·mg-1. For comparison, bare Ag NPs show catalytic activity with a normalized rate constant of 139.78 mL·s-1·mg-1. Furthermore, AgNPs-PTA were stable for more than 15 months under ambient conditions. The ultra-high catalytic and good antimicrobial properties can be attributed to the fine size and good aqueous stability of Ag NPs-PTA. The unique core-shell structure and ease of synthesis render the synthesized nanoparticles superior to others, with potential for large-scale applications, especially in the field of catalysis and medical.
