Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (-60 ppmK-1). The present paper explores the potentiality of a ceramic composite 0.83ZnAl2O4-0.17TiO2 (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK-1 and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm-1K-1 (thermal conductivity of alumina is about 24.5 Wm-1K-1), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates.

Dielectric, thermal and mechanical properties of zirconium silicate reinforced high density polyethylene composites for antenna applications.

A low cost and low dielectric loss zirconium silicate (ZrSiO4) reinforced HDPE (high-density polyethylene) composite has been developed for antenna applications. The 0-3 type composite is prepared by dispersing ZrSiO4 fillers for various volume fractions (0.1 to 0.5) in the HDPE matrix by the melt mixing process. The composite shows good microwave dielectric properties with a relative permittivity of 5.6 and a dielectric loss of 0.003 at 5 GHz at the maximum filler loading of 0.5 volume fraction. The composite exhibits low water absorption, excellent thermal and mechanical properties. It shows a water absorption of 0.03 wt%, a coefficient of thermal expansion of 70 ppm per °C and a room temperature thermal conductivity of 2.4 W mK(-1). The composite shows a tensile strength of 22 MPa and a microhardness of 13.9 kg mm(-2) for the filler loading of 0.5 volume fraction. The HDPE-ZrSiO4 composites show good dielectric, thermal and mechanical properties suitable for microwave soft substrate applications. A microstrip patch antenna is designed and fabricated using the HDPE-0.5 volume fraction ZrSiO4 substrate and the antenna parameters are investigated.