Realizing Single Chip White Light InGaN LED via Dual-Wavelength Multiple Quantum Wells.

Dual-wavelength multiple quantum wells (MQWs) have great potential in realizing high quality illumination, monolithic micro light-emitting diode (LED) displays and other related fields. Here, we demonstrate a single chip white light indium gallium nitride (InGaN) LED via the manipulation of the dual-wavelength MQWs. The MQWs contain four pairs of blue light-emitting MQWs and one pair of green light-emitting QW. The fabricated LED chips with nickel/gold (Ni/Au) as the current spreading layer emit white light with the injection current changing from 0.5 mA to 80 mA. The chromaticity coordinates of (0.3152, 0.329) closing to the white light location in the Commission International de I'Eclairage (CIE) 1931 chromaticity diagram are obtained under a 1 mA current injection with a color rendering index (CRI) Ra of 60 and correlated color temperature (CCT) of 6246 K. This strategy provides a promising route to realize high quality white light in a single chip, which will significantly simplify the production process of incumbent white light LEDs and promote the progress of high-quality illumination.

N-polar GaN Film Epitaxy on Sapphire Substrate without Intentional Nitridation.

High-temperature nitridation is commonly thought of as a necessary process to obtain N-polar GaN films on a sapphire substrate. In this work, high-quality N-polar GaN films were grown on a vicinal sapphire substrate with a 100 nm high-temperature (HT) AlN buffer layer (high V/III ratio) and without an intentional nitriding process. The smallest X-ray full width at half maximum (FWHM) values of the (002)/(102) plane were 237/337 arcsec. On the contrary, N-polar GaN film with an intentional nitriding process had a lower crystal quality. In addition, we investigated the effect of different substrate treatments 1 min before the high-temperature AlN layer's growth on the quality of the N-polar GaN films grown on different vicinal sapphire substrates.

Two-Step Deposition of an Ultrathin GaN Film on a Monolayer MoS2 Template.

Ultrathin gallium nitride (GaN) application can be profoundly influenced by its quality, especially the issue of amorphous interfacial layers formed on conventional substrates. Herein, we report a two-step deposition of an ultrathin GaN film via the plasma-enhanced atomic layer deposition (PEALD) technique on a mono-MoS2 template over a SiO2/Si substrate for quality improvement, by starting the deposition temperature at 260 °C and then ramping it to 320 °C. It was found that a lower initiating deposition temperature could be conducive to maintaining the mono-MoS2 template to support the subsequent growth of GaN. Compared to the control group of one-step high-temperature deposition at 320 °C, ideal layer-by-layer film growth is achieved at the low temperature of the two-step method instead of island formation, leading to the direct crystallization of GaN on the substrate with a rather sharp interface. Structural and chemical characterizations show that this two-step method produces a preferred [0001] orientation of the film originating from the interface region. Additionally, the improved two-step ultrathin GaN displays a smooth surface roughness as low as 0.58 nm, a low oxygen impurity concentration of 3.6%, and a nearly balanced Ga/N stoichiometry of 0.95:1. Our work paves a possible way to the feasible fabrication of ultrathin high-quality PEALD-GaN, and it is promising for better performance of relevant devices.