Robust All-Carbon Molecular Junctions on Flexible or Semi-Transparent Substrates Using "Process-Friendly" Fabrication.

Large area molecular junctions were fabricated on electron-beam deposited carbon (eC) surfaces with molecular layers in the range of 2-5.5 nm between conducting, amorphous carbon contacts. Incorporating eC as an interconnect between Au and the molecular layer improves substrate roughness, prevents electromigration and uses well-known electrochemistry to form a covalent C-C bond to the molecular layer. Au/eC/anthraquinone/eC/Au junctions were fabricated on Si/SiOx with high yield and reproducibility and were unchanged by 10(7) current-voltage cycles and temperatures between 80 and 450 K. Au/eC/AQ/eC/Au devices fabricated on plastic films were unchanged by 10(7) current density vs bias voltage (J-V) cycles and repeated bending of the entire assembled junction. The low sheet resistance of Au/eC substrates permitted junctions with sufficiently transparent electrodes to conduct Raman or UV-vis absorption spectroscopy in either reflection or transmission geometries. Lithographic patterning of Au/eC substrates permitted wafer-scale integration yielding 500 devices on 20 chips on a 100 mm diameter wafer. Collectively, eC on Au provides a platform for fabrication and operation of chemically stable, optically and electrically functional molecules on rigid or flexible materials. The relative ease of processing and the robustness of molecular junctions incorporating eC layers should help address the challenge of economic fabrication of practical, flexible molecular junctions for a potentially wide range of applications.

Musical molecules: the molecular junction as an active component in audio distortion circuits.

Molecular junctions that have a non-linear current-voltage characteristic consistent with quantum mechanical tunneling are demonstrated as analog audio clipping elements in overdrive circuits widely used in electronic music, particularly with electric guitars. The performance of large-area molecular junctions fabricated at the wafer level is compared to currently standard semiconductor diode clippers, showing a difference in the sound character. The harmonic distributions resulting from the use of traditional and molecular clipping elements are reported and discussed, and differences in performance are noted that result from the underlying physics that controls the electronic properties of each clipping component. In addition, the ability to tune the sound using the molecular junction is demonstrated. Finally, the hybrid circuit is compared to an overdriven tube amplifier, which has been the standard reference electric guitar clipped tone for over 60 years. In order to investigate the feasibility of manufacturing molecular junctions for use in commercial applications, devices are fabricated using a low-density format at the wafer level, where 38 dies per wafer, each containing two molecular junctions, are made with exceptional non-shorted yield (99.4%, representing 718 out of 722 tested devices) without requiring clean room facilities.

Microfabrication and integration of diazonium-based aromatic molecular junctions.

Microfabrication techniques common in commercial semiconductor manufacturing were used to produce carbon/nitroazobenzene/Cu/Au molecular junctions with a range of areas from 3×3 to 400×400 µm, starting with 100-mm-diameter silicon wafers. The approach exhibited high yield (90-100%) and excellent reproducibility of the current density (relative standard deviation of typically 15%) and 32 devices on a chip. Electron-beam-deposited carbon films are introduced as substrates and may be applied at the full wafer level before dicing and electrochemical deposition of the molecular layer. The current scaled with the device area over a factor of >600, and the current density was quantitatively consistent with structurally similar molecular junctions made by other techniques. The current densities were weakly dependent on temperature over the range of 100-390 K, and maximum current densities above 400 A/cm2 were observed without breakdown. To simulate processing and operation conditions, the junction stability was tested at elevated temperatures. The JV curves of microfabricated junctions were unchanged after 22 h at 100 °C. A ∼50% increase in the current density was observed after 20 h at 150 °C but then remained constant for an additional 24 h. Parallel fabrication, thermal stability, and high yield are required for practical applications of molecular electronics, and the reported results provide important steps toward integration of molecular electronic devices with commercial processes and devices.

Control of Alq3 wetting layer thickness via substrate surface functionalization.

The effects of substrate surface energy and vapor deposition rate on the initial growth of porous columnar tris(8-hydroxyquinoline)aluminum (Alq3) nanostructures were investigated. Alq3 nanostructures thermally evaporated onto as-supplied Si substrates bearing an oxide were observed to form a solid wetting layer, likely caused by an interfacial energy mismatch between the substrate and Alq3. Wetting layer thickness control is important for potential optoelectronic applications. A dramatic decrease in wetting layer thickness was achieved by depositing Alq3 onto alkyltrichlorosilane-derivatized Si/oxide substrates. Similar effects were noted with increasing deposition rates. These two effects enable tailoring of the wetting layer thickness.