A 1.11 mm2 IVUS SoC with ±50°-Range Plane Wave Transmit Beamforming at 40 MHz.

Intravascular ultrasound (IVUS) imaging catheters are significant tools for cardiovascular interventions, and their use can be expanded by realizing IVUS imaging guidewires and microcatheters. The miniaturization of these devices creates challenges in SNR due to the need for higher frequencies to provide adequate resolution. An integrated IVUS system with transmit beamforming can mitigate these limitations. This work presents the first practical highly integrated system-on-a-chip (SoC) with plane wave transmit beamforming at 40 MHz for IVUS on guidewire or microcatheters. The front-end circuitry has a 20-channel ultrasound transmitter (Tx) and receiver (Rx) array interfaced with a capacitive micromachined ultrasound transducer (CMUT) array. During each firing, all 20 Tx are excited with the same analog delay with respect to each other, which can be continuously adjusted between ~0 and 10 ns in two directions, generating a steerable plane wave in a range of ±/-50° for a phased array at 40 MHz. The unit delays are generated via a voltage-controlled delay line (VCDL), which only needs two external controls, one tuning the unit delay and the other determining the steering direction. The SoC is fabricated using a 180-nm high-voltage (HV) CMOS process and features a slender active area of 0.3 mm × 3.7 mm. The proposed SoC consumes 31.3 mW during the receiving mode. The beamformer's functionality and the SoC's overall performance were validated through acoustic characterization and imaging experiments.

Integrated Hybrid Sub-Aperture Beamforming and Time-Division Multiplexing for Massive Readout in Ultrasound Imaging.

This paper demonstrates hybrid sub-aperture beamforming (SAB) with time-division multiplexing (TDM) for massive interconnect reduction in ultrasound imaging systems. A single-chip front-end system prototype has been fabricated in 180-nm HV BCD technology that combines 5×1 SAB with 8×1 TDM to efficiently reduce the number of receive signal interconnects by a factor of 40. The system includes on-chip high-voltage (HV) pulsers capable of generating unipolar pulses up to 70 V in transmit (TX) mode. The receiver (RX) chain consists of a T/R switch, a variable-gain low-noise amplifier (VG-LNA) with 4-step gain control (15-32 dB) for time-gain compensation followed by a programmable switched-capacitor analog delay-and-sum beamformer. The proof-of-concept prototype operates at a 200-MHz clock frequency and the SAB provides 32-step fine delays with a maximum delay of 310 ns corresponding to better than λ/20 delay quantization at 5 MHz. With these specifications, the SAB is capable of beam steering from 0 ° to 45 ° for a 5-element subarray with 150-micron pitch ( λ/2), providing a near-ideal phased array imaging performance. The sub-aperture beamformer is followed by the TDM system where each of the 8 channels is sampled at a rate of 25 MS/s after an anti-aliasing bandpass filter. The full functionality of the prototype chip is validated through electrical and acoustic measurements on a 1-D capacitive micromachined ultrasonic transducer (CMUT) array designed for intracardiac echocardiography (ICE).

An Adaptive Element-Level Impedance-Matched ASIC With Improved Acoustic Reflectivity for Medical Ultrasound Imaging.

This paper presents an active impedance matching scheme that tries to optimize electrical power transfer and acoustic reflectivity in ultrasound transducers. Leveraging negative capacitance-based impedance matching would potentially improve the bandwidth and electrical power transfer while minimizing acoustic reflection of transducer elements and improve uniformity while reducing acoustic crosstalk of transducer arrays. A 16-element transceiver front-end is designed which employs an element-level active capacitive impedance cancellation scheme using an element-level negative impedance converter. The ASIC fabricated in 180-nm HVBCD technology provides high-voltage pulses up to 60 V consuming 3.6 mW and occupying 2.5 mm2. The front-end ASIC is used with a 1-D capacitive micromachined ultrasonic transducer (CMUT) array and its acoustical reflectivity reduction and imaging capabilities have successfully been demonstrated through pulse-echo measurements and acoustic imaging experiments.

Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip.

In this article, we present a highly integrated guidewire ultrasound (US) imaging system-on-a-chip (GUISoC) for vascular imaging. The SoC consists of a 16-channel US transmitter (Tx) and receiver (Rx) electronics, on-chip power management IC (PMIC), and quadrature sampler. Using a synthetic aperture imaging algorithm, a Tx/Rx pair, connected to capacitive micromachined ultrasound transducers (CMUTs), can be activated at any time. The Tx generates acoustic waves by driving the CMUT, while the Rx picks up the echo signal and amplify it to be delivered through an interconnect that is driven by a buffer. On-chip logic controls the pulsers that generate the high-voltage (HV)-pulse for Tx. An on-chip PMIC provides 1.8-, 5-, 39-, and 44-V supplies and a clock signal from the two interconnects besides GND. A quadrature sampler down-converts the Rx echo signal to baseband, reducing its bandwidth requirement for the output interconnect. The system design, including transimpedance amplifier (TIA) optimization, based on the equivalent circuit of a specific CMUT is presented. The SoC was fabricated by a 0.18-µm HV CMOS process, occupying 1.5-mm2 active area and consuming 25.2 and 44 mW from 1.8 to 44 V supplies, respectively. The US Tx and Rx show bandwidths of 32-42 and 32.7-37.5 MHz, respectively. The input-referred noise of the system was measured as 9.66 nA in band with 2-m-long 52 American Wire Gauge (AWG) wire interconnects. The functionality of the GUISoC was verified in vitro by imaging wire targets.

Supply-Inverted Bipolar Pulser and Tx/Rx Switch for CMUTs Above the Process Limit for High Pressure Pulse Generation.

A combined supply-inverted bipolar pulser and a Tx/Rx switch is proposed to drive capacitive micromachined ultrasonic transducers (CMUTs). The supply-inverted bipolar pulser adopts a bootstrap circuit combined with stacked transistors, which guarantees high voltage (HV) operation above the process limit without lowering device reliability. This circuit generates an output signal with a peak-to-peak voltage that is almost twice the supply level. It generates a bipolar pulse with only positive supply voltages. The Tx/Rx switch adopts a diode-bridge structure with the protection scheme dedicated to this proposed pulser. A proof- of-concept ASIC prototype has been implemented in 0.18-µm HV CMOS/DMOS technology with 60 V devices. Measurement results show that the proposed pulser can safely generate a bipolar pulse of -34.6 to 45 V, from a single 45 V supply voltage. The Tx/Rx switch blocks the HV bipolar pulse, resulting in less than 1.6 V at the input of the receiver. Acoustic measurements are performed connecting the pulser to CMUTs with 2 pF capacitance and 8 MHz center frequency. The variation of acoustic output pressures for different pulse shapes were simulated with the large signal CMUT model and compared with the experimental results for transmit pressure optimization. A potential implementation of the methods using MEMS fabrication methods is also described.

A Reduced-Wire ICE Catheter ASIC With Tx Beamforming and Rx Time-Division Multiplexing.

This paper presents a single chip reduced-wire active catheter application-specific integrated circuit (ASIC), equipped with programmable transmit (Tx) beamforming and receive (Rx) time-division multiplexing (TDM). The proposed front-end ASIC is designed for driving a 64-channel one-dimensional transducer array in intracardiac echocardiography (ICE) ultrasound catheters. The ASIC is implemented in 60 V 0.18-µm HV-BCD technology, integrating Tx beamformers with high voltage pulsers and Rx front end in the same chip, which occupies 2.6 × 11 mm2 that can fit in the catheter size of 9 F (<3 mm). The proposed system reduces the number of wires from >64 to only 22 by integrating Tx beamformer that is programmable using a single low-voltage differential signaling data line. In Rx mode, the system uses 8:1 TDM with direct digital demultiplexing providing raw channel data that enables dynamic Rx beamforming using individual array elements. This system has been successfully used for B-mode imaging on standard ultrasound phantom with 401 mW of average power consumption. The ASIC has a compact element pitch-matched layout, which is also compatible with capacitive micromachined ultrasound transducer on CMOS application. This system addresses cable number and dimensional restrictions in catheters to enable ICE imaging under magnetic resonance imaging by reducing radio frequency induced heating.

Supply-Doubled Pulse-Shaping High Voltage Pulser for CMUT Arrays.

A supply-doubled pulse-shaping high voltage (HV) pulser is presented for medical ultrasound imaging applications, particularly those that use capacitive micromachined ultrasonic transducers (CMUT). The pulser employs a bootstrap circuit combined with dynamically-biased stacked transistors, which allow HV operation above process limit without lowering device reliability. The new pulser overcomes supply voltage limitation of conventional unipolar pulsers by generating output signals that are almost twice the supply level. It also can generate three-level pulses to further optimize the transmit pressure signals. A proof-of-concept prototype has been implemented in 0.18-µm HV CMOS/DMOS technology with 60 V devices. Measurement results show that the HV pulser can safely generate controllable three-level pulses with up to 85 Vpp from 45 V supply. Acoustic measurements are conducted connecting the pulser to a CMUT with 2 pF capacitance and 8.3 MHz center frequency. The pulse shape has been adjusted for the CMUT under test to generate maximum pressure output and the results are in good agreement with a large signal CMUT model.

Towards a Reduced-Wire Interface for CMUT-Based Intravascular Ultrasound Imaging Systems.

Having intravascular ultrasound (IVUS) imaging capability on guide wires used in cardiovascular interventions may eliminate the need for separate IVUS catheters and expand the use of IVUS in a larger portion of the vasculature. High frequency capacitive micro machined ultrasonic transducer (CMUT) arrays should be integrated with interface electronics and placed on the guide wire for this purpose. Besides small size, this system-on-a-chip (SoC) front-end should connect to the back-end imaging system with a minimum number of wires to preserve the critical mechanical properties of the guide wire. We present a 40 MHz CMUT array interface SoC, which will eventually use only two wires for power delivery and transmits image data using a combination of analog-to-time conversion (ATC) and an impulse radio ultra-wideband (IR-UWB) wireless link. The proof-of-concept prototype ASIC consumes only 52.8 mW and occupies 4.07 [Formula: see text] in a 0.35- [Formula: see text] standard CMOS process. A rectifier and regulator power the rest of the SoC at 3.3 V from a 10 MHz power carrier that is supplied through a 2.4 m micro-coax cable with an overall efficiency of 49.1%. Echo signals from an 8-element CMUT array are amplified by a transimpedance amplifier (TIA) array and down-converted to baseband by quadrature sampling using a 40 MHz clock, derived from the power carrier. The ATC generates pulse-width-modulated (PWM) samples at 2 × 10 MS/s with 6 bit resolution, while the entire system achieved 5.1 ENOB. Preliminary images from the prototype system are presented, and alternative data transmission and possible future directions towards practical implementation are discussed.

CMUTs with high-K atomic layer deposition dielectric material insulation layer.

Use of high-κ dielectric, atomic layer deposition (ALD) materials as an insulation layer material for capacitive micromachined ultrasonic transducers (CMUTs) is investigated. The effect of insulation layer material and thickness on CMUT performance is evaluated using a simple parallel plate model. The model shows that both high dielectric constant and the electrical breakdown strength are important for the dielectric material, and significant performance improvement can be achieved, especially as the vacuum gap thickness is reduced. In particular, ALD hafnium oxide (HfO2) is evaluated and used as an improvement over plasma-enhanced chemical vapor deposition (PECVD) silicon nitride (Six)Ny)) for CMUTs fabricated by a low-temperature, complementary metal oxide semiconductor transistor-compatible, sacrificial release method. Relevant properties of ALD HfO2) such as dielectric constant and breakdown strength are characterized to further guide CMUT design. Experiments are performed on parallel fabricated test CMUTs with 50-nm gap and 16.5-MHz center frequency to measure and compare pressure output and receive sensitivity for 200-nm PECVD Six)Ny) and 100-nm HfO2) insulation layers. Results for this particular design show a 6-dB improvement in receiver output with the collapse voltage reduced by one-half; while in transmit mode, half the input voltage is needed to achieve the same maximum output pressure.

Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging.

Intravascular ultrasound (IVUS) and intracardiac echography (ICE) catheters with real-time volumetric ultrasound imaging capability can provide unique benefits to many interventional procedures used in the diagnosis and treatment of coronary and structural heart diseases. Integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with front-end electronics in single-chip configuration allows for implementation of such catheter probes with reduced interconnect complexity, miniaturization, and high mechanical flexibility. We implemented a single-chip forward-looking (FL) ultrasound imaging system by fabricating a 1.4-mm-diameter dual-ring CMUT array using CMUT-on-CMOS technology on a front-end IC implemented in 0.35-µm CMOS process. The dual-ring array has 56 transmit elements and 48 receive elements on two separate concentric annular rings. The IC incorporates a 25-V pulser for each transmitter and a low-noise capacitive transimpedance amplifier (TIA) for each receiver, along with digital control and smart power management. The final shape of the silicon chip is a 1.5-mm-diameter donut with a 430-µm center hole for a guide wire. The overall front-end system requires only 13 external connections and provides 4 parallel RF outputs while consuming an average power of 20 mW. We measured RF A-scans from the integrated single- chip array which show full functionality at 20.1 MHz with 43% fractional bandwidth. We also tested and demonstrated the image quality of the system on a wire phantom and an ex vivo chicken heart sample. The measured axial and lateral point resolutions are 92 µm and 251 µm, respectively. We successfully acquired volumetric imaging data from the ex vivo chicken heart at 60 frames per second without any signal averaging. These demonstrative results indicate that single-chip CMUT-on-CMOS systems have the potential to produce realtime volumetric images with image quality and speed suitable for catheter-based clinical applications.

Volumetric imaging using single chip integrated CMUT-on-CMOS IVUS array.

An intravascular ultrasound (IVUS) catheter that can provide forward viewing volumetric ultrasound images would be an invaluable clinical tool for guiding interventions. Single chip integration of front-end electronics with capacitive micromachined ultrasonic transducers (CMUTs) is highly desirable to reduce the interconnection complexity and enable miniaturization in IVUS catheters. For this purpose we use the monolithic CMUT-on-CMOS integration where CMUTs are fabricated directly on top of pre-processed CMOS wafers. This minimizes parasitic capacitances associated with connection lines. We have recently implemented a system design including all the required electronics using 0.35-µm CMOS process integrated with a 1.4-mm diameter CMUT array. In this study, we present the experimental volumetric imaging results from an ex-vivo chicken heart phantom. The imaging results demonstrate that the single-chip forward looking IVUS (FL-IVUS) system with monolithically integrated electronics has potential to visualize the front view of coronary arteries.

Optimizing circular ring arrays for forward-looking IVUS imaging.

Forward-looking (FL) catheter-based imaging systems are highly desirable for guiding interventions in intra- vascular ultrasound (IVUS) applications. One of the main challenges of array-based FL-IVUS systems is the large channel count, which results in increased system complexity. Synthetic phased-array processing with a reduced firing count simplifies the front-end and, hence, can enable 3-D real-time imaging. Recently, we have investigated dual-ring arrays suitable for IVUS imaging, in which the two concentric circular arrays are used separately as transmit (Tx) and receive (Rx) arrays. In this study, we present different optimized array designs based on dual and single circular rings which are suitable for synthetic phased-array processing with a reduced number of firings. To obtain an optimal firing set that produces low side lobes in the wideband response, we use a simulated annealing algorithm. In the simulations, we use 1.2-mm-diameter array configurations with 64 Tx and 58 Rx elements, a center frequency of 20 MHz and fractional bandwidths of 50% and 80%. The results show that optimized dual-ring arrays provide 8 dB improvements in peak near side-lobe level with no widening in the main lobe width when compared with full and other sparse co-arrays.