Heat Emitting Damage in Skin: A Thermal Pathway for Mechanical Algesia.

Mechanical pain (or mechanical algesia) can both be a vital mechanism warning us for dangers or an undesired medical symptom important to mitigate. Thus, a comprehensive understanding of the different mechanisms responsible for this type of pain is paramount. In this work, we study the tearing of porcine skin in front of an infrared camera, and show that mechanical injuries in biological tissues can generate enough heat to stimulate the neural network. In particular, we report local temperature elevations of up to 24°C around fast cutaneous ruptures, which shall exceed the threshold of the neural nociceptors usually involved in thermal pain. Slower fractures exhibit lower temperature elevations, and we characterise such dependency to the damaging rate. Overall, we bring experimental evidence of a novel-thermal-pathway for direct mechanical algesia. In addition, the implications of this pathway are discussed for mechanical hyperalgesia, in which a role of the cutaneous thermal sensors has priorly been suspected. We also show that thermal dissipation shall actually account for a significant portion of the total skin's fracture energy, making temperature monitoring an efficient way to detect biological damages.

Thermally activated intermittent dynamics of creeping crack fronts along disordered interfaces.

We present a subcritical fracture growth model, coupled with the elastic redistribution of the acting mechanical stress along rugous rupture fronts. We show the ability of this model to quantitatively reproduce the intermittent dynamics of cracks propagating along weak disordered interfaces. To this end, we assume that the fracture energy of such interfaces (in the sense of a critical energy release rate) follows a spatially correlated normal distribution. We compare various statistical features from the obtained fracture dynamics to that from cracks propagating in sintered polymethylmethacrylate (PMMA) interfaces. In previous works, it has been demonstrated that such an approach could reproduce the mean advance of fractures and their local front velocity distribution. Here, we go further by showing that the proposed model also quantitatively accounts for the complex self-affine scaling morphology of crack fronts and their temporal evolution, for the spatial and temporal correlations of the local velocity fields and for the avalanches size distribution of the intermittent growth dynamics. We thus provide new evidence that an Arrhenius-like subcritical growth is particularly suitable for the description of creeping cracks.

Thermal dissipation as both the strength and weakness of matter. A material failure prediction by monitoring creep.

In any domain involving some stressed solids, that is, from seismology to general engineering, the strength of matter is a paramount feature to understand. We here discuss the ability of a simple thermally activated sub-critical model, which includes the auto-induced thermal evolution of cracks tips, to predict the catastrophic failure of a vast range of materials. It is in particular shown that the intrinsic surface energy barrier, for breaking the atomic bonds of many solids, can be easily deduced from the slow creeping dynamics of a crack. This intrinsic barrier is however higher than the macroscopic load threshold at which brittle matter brutally fails, possibly as a result of thermal activation and of a thermal weakening mechanism. We propose a novel method to compute this macroscopic energy release rate of rupture, Ga, solely from monitoring slow creep, and we show that this reproduces the experimental values within 50% accuracy over twenty different materials, and over more than four decades of fracture energy.

How heat controls fracture: the thermodynamics of creeping and avalanching cracks.

While of paramount importance in material science, the dynamics of cracks still lacks a complete physical explanation. The transition from their slow creep behavior to a fast propagation regime is a notable key, as it leads to full material failure if the size of a fast avalanche reaches that of the system. We here show that a simple thermodynamics approach can actually account for such complex crack dynamics, and in particular for the non-monotonic force-velocity curves commonly observed in mechanical tests on various materials. We consider a thermally activated failure process that is coupled with the production and the diffusion of heat at the fracture tip. In this framework, the rise in temperature only affects the sub-critical crack dynamics and not the mechanical properties of the material. We show that this description can quantitatively reproduce the rupture of two different polymeric materials (namely, the mode I opening of polymethylmethacrylate (PMMA) plates, and the peeling of pressure sensitive adhesive (PSA) tapes), from the very slow to the very fast fracturing regimes, over seven to nine decades of crack propagation velocities. In particular, the fastest regime is obtained with an increase of temperature of thousands of Kelvins, on the molecular scale around the crack tip. Although surprising, such an extreme temperature is actually consistent with different experimental observations that accompany the fast propagation of cracks, namely, fractoluminescence (i.e., the emission of visible light during rupture) and a complex morphology of post-mortem fracture surfaces, which could be due to the sublimation of bubbles.

How cracks are hot and cool: a burning issue for paper.

Material failure is accompanied by important heat exchange, with extremely high temperature - thousands of degrees - reached at crack tips. Such a temperature may subsequently alter the mechanical properties of stressed solids, and finally facilitate their rupture. Thermal runaway weakening processes could indeed explain stick-slip motions and even be responsible for deep earthquakes. Therefore, to better understand catastrophic rupture events, it appears crucial to establish an accurate energy budget of fracture propagation from a clear measure of various energy dissipation sources. In this work, combining analytical calculations and numerical simulations, we directly relate the temperature field around a moving crack tip to the part α of mechanical energy converted into heat. By monitoring the slow crack growth in paper sheets using an infrared camera, we measure a significant fraction α = 12% ± 4%. Besides, we show that (self-generated) heat accumulation could weaken our samples by microfiber combustion, and lead to a fast crack/dynamic failure/regime.