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1.
Sensors (Basel) ; 21(7)2021 Mar 24.
Article in English | MEDLINE | ID: mdl-33804840

ABSTRACT

Human motion analysis is a valuable tool for assessing disease progression in persons with conditions such as multiple sclerosis or Parkinson's disease. Human motion tracking is also used extensively for sporting technique and performance analysis as well as for work life ergonomics evaluations. Wearable inertial sensors (e.g., accelerometers, gyroscopes and/or magnetometers) are frequently employed because they are easy to mount and can be used in real life, out-of-the-lab-settings, as opposed to video-based lab setups. These distributed sensors cannot, however, measure relative distances between sensors, and are also cumbersome when it comes to calibration and drift compensation. In this study, we tested an ultrasonic time-of-flight sensor for measuring relative limb-to-limb distance, and we developed a combined inertial sensor and ultrasonic time-of-flight wearable measurement system. The aim was to investigate if ultrasonic time-of-flight sensors can supplement inertial sensor-based motion tracking by providing relative distances between inertial sensor modules. We found that the ultrasonic time-of-flight measurements reflected expected walking motion patterns. The stride length estimates derived from ultrasonic time-of-flight measurements corresponded well with estimates from validated inertial sensors, indicating that the inclusion of ultrasonic time-of-flight measurements could be a feasible approach for improving inertial sensor-only systems. Our prototype was able to measure both inertial and time-of-flight measurements simultaneously and continuously, but more work is necessary to merge the complementary approaches to provide more accurate and more detailed human motion tracking.


Subject(s)
Ultrasonics , Walking , Biomechanical Phenomena , Calibration , Humans , Motion
2.
Ultrasonics ; 96: 160-164, 2019 Jul.
Article in English | MEDLINE | ID: mdl-30771908

ABSTRACT

We have investigated transmission of ultrasound signals from a speaker in air through a 400 µm thick borosilicate glass plate, similar to those found in consumer electronics products such as mobile phones and tablets. In order to enhance transmission, we took advantage of resonances in the glass plate and a cavity, which is placed between the glass and the microphone. The results show that it is possible to achieve transmission of a signal with bandwidth of approximately 5 kHz with less than -10 dB attenuation, and only -2 dB attenuation at the resonance peak frequency. With more optimized assembly the attenuation can be further reduced. Finite element simulations and analytical considerations show that there are two main resonance peaks, attributed to the glass resonance and cavity resonance, respectively. The geometry can be tuned to exploit the synergy of these two resonances in order to tailor the peak frequency, the bandwidth and to optimize transmission.

3.
Water Sci Technol ; 73(8): 1769-76, 2016.
Article in English | MEDLINE | ID: mdl-27120629

ABSTRACT

The startup of microbial fuel cells (MFCs) is known to be prone to failure or result in erratic performance impeding the research. The aim of this study was to advise a quick launch strategy for laboratory-scale MFCs that ensures steady operation performance in a short period of time. Different startup strategies were investigated and compared with membraneless single chamber MFCs. A direct surface-to-surface biofilm transfer (BFT) in an operating MFC proved to be the most efficient method. It provided steady power densities of 163 ± 13 mWm(-2) 4 days after inoculation compared to 58 ± 15 mWm(-2) after 30 days following a conventional inoculation approach. The in situ BFT eliminates the need for microbial acclimation during startup and reduces performance fluctuations caused by shifts in microbial biodiversity. Anaerobic pretreatment of the substrate and addition of suspended enzymes from an operating MFC into the new MFC proved to have a beneficial effect on startup and subsequent operation. Polarization methods were applied to characterize the startup phase and the steady state operation in terms of power densities, internal resistance and power overshoot during biofilm maturation. Applying this method a well-working MFC can be multiplied into an array of identically performing MFCs.


Subject(s)
Bacteria/metabolism , Bacterial Physiological Phenomena , Bioelectric Energy Sources , Biofilms/growth & development , Electric Impedance
4.
Micromachines (Basel) ; 7(10)2016 Oct 18.
Article in English | MEDLINE | ID: mdl-30404365

ABSTRACT

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based on low-temperature adhesive wafer bonding, which ensures full complementary metal-oxide-semiconductor (CMOS) compatibility. All necessary fabrication steps for the wafer bonding, such as cavity formation and deposition of the adhesive, are performed on the capping substrate. The polymer adhesive is deposited by spray-coating on the capping wafer containing the cavities. Thus, no lithographic patterning of the polymer adhesive is needed, and material waste is minimized. Furthermore, this process does not require any additional fabrication steps on the device wafer, which lowers the process complexity and fabrication costs. We demonstrate the proposed capping method by packaging two different MEMS devices. The two MEMS devices include a vibration sensor and an acceleration switch, which employ two different electrical interconnection schemes. The experimental results show wafer-level capping with excellent bond quality due to the re-flow behavior of the polymer adhesive. No impediment to the functionality of the MEMS devices was observed, which indicates that the encapsulation does not introduce significant tensile nor compressive stresses. Thus, we present a highly versatile, robust, and cost-efficient capping method for components such as MEMS and imaging sensors.

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