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1.
Nat Commun ; 14(1): 7601, 2023 Nov 22.
Article in English | MEDLINE | ID: mdl-37990012

ABSTRACT

Diffusion is one of the most important phenomena studied in science ranging from physics to biology and, in abstract form, even in social sciences. In the field of materials science, diffusion in crystalline solids is of particular interest as it plays a pivotal role in materials synthesis, processing and applications. While this subject has been studied extensively for a long time there are still some fundamental knowledge gaps to be filled. In particular, atomic scale observations of thermally stimulated volume diffusion and its mechanisms are still lacking. In addition, the mechanisms and kinetics of diffusion along defects such as grain boundaries are not yet fully understood. In this work we show volume diffusion processes of tungsten atoms in a metal matrix on the atomic scale. Using in situ high resolution scanning transmission electron microscopy we are able to follow the random movement of single atoms within a lattice at elevated temperatures. The direct observation allows us to confirm random walk processes, quantify diffusion kinetics and distinctly separate diffusion in the volume from diffusion along defects. This work solidifies and refines our knowledge of the broadly essential mechanism of volume diffusion.

2.
Nanoscale ; 15(21): 9477-9483, 2023 Jun 01.
Article in English | MEDLINE | ID: mdl-37161753

ABSTRACT

The creation of hollow nanomaterials based on metal oxides has become an important research topic, as they show potential in a broad range of technical applications. However, the controlled synthesis of long and at the same time thin nanotubes is still challenging. Here we present a universal approach to create ultrathin aluminum oxide nanotubes with a length/diameter ratio of >1200 and minimum wall thickness of ≤4 nm. We use a facile process based on defined heat treatment of specific core-shell nanowires. The metal nanowires act as a template, which is thermally removed during heat treatment until an empty tube is created. The core-shell nanowires are produced by Physical Vapour Deposition (PVD) with a subsequent coating via Atomic Layer Deposition (ALD). The custom-built PVD-ALD system enables a direct sample transfer without breaking the vacuum, which allows determining the effect of a native oxide layer on the metal-ALD bonding. In combination with correlative ex situ observations, in situ Transmission Electron Microscopy (TEM) heating experiments unravel the dynamical processes going on at small scales. Based on the microscopic analysis, the energetics of the core material is analyzed, giving insights about heat induced effects as well as the phase transition from the amorphous to the crystalline state.

3.
Nanotechnology ; 34(17)2023 Feb 13.
Article in English | MEDLINE | ID: mdl-36649645

ABSTRACT

Flexible electrodes using nanowires (NWs) suffer from challenges of long-term stability and high junction resistance which limit their fields of applications. Welding via thermal annealing is a common strategy to enhance the conductivity of percolated NW networks, however, it affects the structural and mechanical integrity of the NWs. In this study we show that the decoration of NWs with an ultrathin metal oxide is a potential alternative procedure which not only enhances the thermal and chemical stability but, moreover, provides a totally different mechanism to reduce the junction resistance upon heat treatment. Here, we analyze the effect of SnOxdecoration on the conductance of silver NWs and NW junctions by using a four-probe measurement setup inside a scanning electron microscope. Dedicated transmission electron microscopy analysis in plan-view and cross-section geometry are carried out to characterize the nanowires and the microstructure of the junctions. Upon heat treatment the junction resistance of both plain silver NWs and SnOx-decorated NWs is reduced by around 80%. While plain silver NWs show characteristic junction welding during annealing, the SnOx-decoration reduces junction resistance by a solder-like process which does not affect the mechanical integrity of the NW junction and is therefore expected to be superior for applications.

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