ABSTRACT
Microbiologically influenced corrosion (MIC) or biocrorrosion is a cause of huge economic set back for industries around the globe. The present work deals with the study of corrosion of copper alloy (Cu-Ni 70:30) in the presence of bacterial biofilms produced by Bacillus subtilis strain S1X and Pseudomonas aeruginosa strain ZK. MIC was investigated using electrochemical techniques such as potentiodynamic polarization and electrochemical impedance spectroscopy, and through analytical techniques such as scanning electron microscopy (SEM), Fourier-transform infrared spectroscopy (FTIR), and atomic force microscopy (AFM). The Cu-Ni coupons were exposed to bacteria in minimal salt medium supplemented with NaCl for a period of 15 days. AFM and FTIR analysis revealed formation of a thick biofilm on the surface of the Cu alloy in bacterial inoculated systems. The electrochemical results demonstrated a decreased current density and corrosion rate for the systems with bacterial biofilms. These findings were supported by the results of SEM and weight loss studies. The results showed the inhibition of corrosion for Cu-Ni in biotic conditions (with biofilms) as compared with abiotic conditions (without biofilms).
