4D Printing of Ultrastretchable Magnetoactive Soft Material Architectures for Soft Actuators.

Magnetoactive soft materials (MSMs) comprising magnetic particles and soft matrices have emerged as smart materials for realizing soft actuators. 4D printing, which involves fabricating 3D architectures that can transform shapes under external magnetic fields, is an effective way to fabricate MSMs-based soft actuators with complex shapes. The printed MSMs must be flexible, stretchable, and adaptable in their magnetization profiles to maximize the degrees of freedom for shape morphing. This study utilizes a facile 4D printing strategy for producing ultrastretchable (stretchability > 1000%) MSM 3D architectures for soft-actuator applications. The strategy involves two sequential steps: (i) direct ink writing (DIW) of the MSM 3D architectures with ink composed of NdFeB and styrene-isoprene block copolymers (SIS) at room temperature and (ii) programming and reconfiguration of the magnetization profiles of the printed architecture using an origami-inspired magnetization method (magnetization field, Hm = 2.7 T). Various differently shaped MSM 3D architectures, which can be transformed into desired shapes under an actuation magnetic field (Ba = 85 mT), are successfully fabricated. In addition, two different soft-actuator applications are demonstrated: a multifinger magnetic soft gripper and a Kirigami-shaped 3D electrical switch with conductive and magnetic functionalities. Our strategy shows potential for realizing multifunctional, shape-morphing, and reprogrammable magnetoactive devices for advanced soft-actuator applications.

Comparative study and multi-parameter analysis to optimize device structure of triboelectric nanogenerators.

Triboelectric nanogenerator is becoming one of the most efficient energy harvesting device among all mechanical energy harvesters. This device consists of dielectric friction layers and metal electrode which generates electrical charges using electrostatic induction effect. There are several factors influencing the performance of this generator which needs to be evaluated prior to experiment. The absence of a universal technique for TENG simulation makes the device design and optimization hard before practical fabrication, which also lengthens the exploration and advancement cycle and hinders the arrival of practical applications. In order to deepen the understanding the core physic behind the working process of this device, this work will provide comparative analysis on different modes of TENG. Systematic investigation on different material combination, effect of material thickness, dielectric constant and impact of surface patterning is evaluated to shortlist the best material combination. COMSOL Multiphysics simulating environment is used to design, model and analyze factor affecting the overall output performance of TENG. The stationary study in this simulator is performed using 2D geometry structure with higher mesh density. During this study short circuit and open circuit condition were applied to observe the behavior of charge and electric potential produced. This observation is analyzed by plotting charge transfer/electric potential against various displacement distances of dielectric friction layers. The ouput is then provided to load ciruitary to measure the maximum output power of the models. Overall, this study provides an excellent understanding and multi-parameter analysis on basic theoretical and simulation modeling of TENG device.

3D-Printed Quantum Dot Nanopixels.

The pixel is the minimum unit used to represent or record information in photonic devices. The size of the pixel determines the density of the integrated information, such as the resolution of displays or cameras. Most methods used to produce display pixels are based on two-dimensional patterning of light-emitting materials. However, the brightness of the pixels is limited when they are miniaturized to nanoscale dimensions owing to their limited volume. Herein, we demonstrate the production of three-dimensional (3D) pixels with nanoscale dimensions based on the 3D printing of quantum dots embedded in polymer nanowires. In particular, a femtoliter meniscus was used to guide the solidification of liquid inks to form vertically freestanding nanopillar structures. Based on the 3D layout, we show high-density integration of color pixels, with a lateral dimension of 620 nm and a pitch of 3 µm for each of the red, green, and blue colors. The 3D structure enabled a 2-fold increase in brightness without significant effects on the spatial resolution of the pixels. In addition, we demonstrate individual control of the brightness based on a simple adjustment of the height of the 3D pixels. This method can be used to achieve super-high-resolution display devices and various photonic applications across a range of disciplines.

3D-printed Cu2O photoelectrodes for photoelectrochemical water splitting.

Photoelectrochemical (PEC) water splitting is an alternative to fossil fuel combustion involving the generation of renewable hydrogen without environmental pollution or greenhouse gas emissions. Cuprous oxide (Cu2O) is a promising semiconducting material for the simple reduction of hydrogen from water, in which the conduction band edge is slightly negative compared to the water reduction potential. However, the solar-to-hydrogen conversion efficiency of Cu2O is lower than the theoretical value due to a short carrier-diffusion length under the effective light absorption depth. Thus, increasing light absorption in the electrode-electrolyte interfacial layer of a Cu2O photoelectrode can enhance PEC performance. In this study, a Cu2O 3D photoelectrode comprised of pyramid arrays was fabricated using a two-step method involving direct-ink-writing of graphene structures. This was followed by the electrodeposition of a Cu current-collecting layer and a p-n homojunction Cu2O photocatalyst layer onto the printed structures. The performance for PEC water splitting was enhanced by increasing the total light absorption area (A a) of the photoelectrode via controlling the electrode topography. The 3D photoelectrode (A a = 3.2 cm2) printed on the substrate area of 1.0 cm2 exhibited a photocurrent (I ph) of -3.01 mA at 0.02 V (vs. RHE), which is approximately three times higher than that of a planar photoelectrode with an A a = 1.0 cm2 (I ph = -0.91 mA). Our 3D printing strategy provides a flexible approach for the design and the fabrication of highly efficient PEC photoelectrodes.

3D printing of highly conductive silver architectures enabled to sinter at low temperatures.

Silver (Ag) nanoparticle-based inks are frequently used in printed electronics to form conductive patterns, but often require high-temperature sintering to achieve the optimum electrical conductivity, hindering their use in substrates with poor heat resistance. Herein, a three-dimensional (3D) printing strategy to produce highly conductive Ag 3D architectures that can be sintered at low temperatures is reported. This strategy is based on the additive deposition of Ag nanoparticles and microflakes via extrusion-based 3D printing with the Ag ink that involves poly(acrylic acid) (PAA)-stabilized Ag nanoparticles, Ag microflakes, and NaCl - a destabilizing agent. The designed Ag inks are stable and suitable for ink-extrusion 3D printing. In chemical sintering, Cl- can detach PAA from the Ag nanoparticle surface, enabling nanoparticle coalescence and sintering. An elevated annealing temperature induces increased NaCl density in the printed patterns and accelerates the surface and grain boundary diffusion of Ag atoms, contributing to enhance chemical sintering. On annealing at ∼110 °C for 30 min, the printed structures exhibited an electrical conductivity of ∼9.72 × 104 S cm-1, which is ∼15.6% of that of bulk Ag. Complicated Ag architectures with diverse shapes were successfully fabricated on polymeric substrates. Several structural electronic applications were demonstrated by hybrid 3D printing combining our extrusion-based 3D printing and conventional fused deposition modeling (FDM).

Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics.

Three-dimensional (3D) printing is a next-generation free-form manufacturing technology for structural electronics. The realization of structural electronic devices necessitates the direct integration of electronic circuits into 3D objects. However, creating highly conductive, high-resolution patterns in 3D remains a major challenge. Here, we report on a metallic 3D printing method that incorporates electroless deposition (ELD) into the direct ink writing method. Our approach consists of two steps: (1) direct ink writing of catalyst microstructures with a functional catalyst ink containing Ag ions and (2) ELD of Cu onto the printed catalyst structures. High-quality, stable Cu 3D printing is achieved through the design of the Ag catalyst ink; hydroxypropyl cellulose is added as both a rheological modifier (printing) and dissolution inhibitor (ELD). As a result, various two-dimensional (2D) and 3D Cu micro circuitries with high conductivity (∼65% of bulk) can be directly integrated onto 3D plastic substrates without the need for high-temperature annealing. A hybrid strategy that combines ELD-assisted 3D printing and conventional fused deposition modeling enables full fabrication of structural electronic devices. This 3D printing strategy can be a low-cost and facile method for obtaining highly conductive metallic 2D and 3D microstructures in structural electronics.

Flexible Strain Sensors Fabricated by Meniscus-Guided Printing of Carbon Nanotube-Polymer Composites.

Printed strain sensors have promising potential as a human-machine interface (HMI) for health-monitoring systems, human-friendly wearable interactive systems, and smart robotics. Herein, flexible strain sensors based on carbon nanotube (CNT)-polymer composites were fabricated by meniscus-guided printing using a CNT ink formulated from multiwall nanotubes (MWNTs) and polyvinylpyrrolidone (PVP); the ink was suitable for micropatterning on nonflat (or curved) substrates and even three-dimensional structures. The printed strain sensors exhibit a reproducible response to applied tensile and compressive strains, having gauge factors of 13.07 under tensile strain and 12.87 under compressive strain; they also exhibit high stability during ∼1500 bending cycles. Applied strains induce a contact rearrangement of the MWNTs and a change in the tunneling distance between them, resulting in a change in the resistance (Δ R/ R0) of the sensor. Printed MWNT-PVP sensors were used in gloves for finger movement detection; these can be applied to human motion detection and remote control of robotic equipment. Our results demonstrate that meniscus-guided printing using CNT inks can produce highly flexible, sensitive, and inexpensive HMI devices.

Three-dimensional Printing of Silver Microarchitectures Using Newtonian Nanoparticle Inks.

Although three-dimensional (3D) printing has recently emerged as a technology to potentially bring about the next industrial revolution, the limited selection of usable materials restricts its use to simple prototyping. In particular, metallic 3D printing with submicrometer spatial resolution is essential for the realization of 3D-printed electronics. Herein, a meniscus-guided 3D printing method that exploits a low-viscosity (∼7 mPa·s) silver nanoparticle (AgNP) ink meniscus with Newtonian fluid characteristics (which is compatible with conventional inkjet printers) to fabricate 3D silver microarchitectures is reported. Poly(acrylic acid)-capped AgNP ink that exhibits a continuous ink flow through a confined nozzle without aggregation is designed in this study. Guiding the ink meniscus with controlled direction and speed enables both vertical pulling and layer-by-layer processing, resulting in the creation of 3D microobjects with designed shapes other than those for simple wiring. Various highly conductive (>104 S·cm-1) 3D metallic patterns are demonstrated for applications in electronic devices. This research is expected to widen the range of materials that can be employed in 3D printing technology, with the aim of moving 3D printing beyond prototyping and into real manufacturing platforms for future electronics.

Three-Dimensional Printing of Highly Conductive Carbon Nanotube Microarchitectures with Fluid Ink.

Moving printed electronics to three dimensions essentially requires advanced additive manufacturing techniques yielding multifunctionality materials and high spatial resolution. Here, we report the meniscus-guided 3D printing of highly conductive multiwall carbon nanotube (MWNT) microarchitectures that exploit rapid solidification of a fluid ink meniscus formed by pulling a micronozzle. To achieve high-quality printing with continuous ink flow through a confined nozzle geometry, that is, without agglomeration and nozzle clogging, we design a polyvinylpyrrolidone-wrapped MWNT ink with uniform dispersion and appropriate rheological properties. The developed technique can produce various desired 3D microstructures, with a high MWNT concentration of up to 75 wt % being obtained via post-thermal treatment. Successful demonstrations of electronic components such as sensing transducers, emitters, and radio frequency inductors are also described herein. We expect that the technique presented in this study will facilitate selection of diverse materials in 3D printing and enhance the freedom of integration for advanced conceptual devices.