Experimental Study on the Grinding of an Fe-Cr-Co Permanent Magnet Alloy under a Small Cutting Depth.

A small cutting depth is the key parameter to realize precision in the machining process. The stability of the machining process will directly affect the quality of machining. In this study, dry grinding experiments using an Fe-Cr-Co permanent magnet alloy with small cutting depths (5 µm) were carried out. The relationship between the number of peaks and valleys and the quality control of the grinding force, wheel speed and feed speed were analyzed. The relationship between the peak and valley values of the grinding force signals and the peak and valley values of the grinding surface obtained using a white light interferometer was revealed. The influence of the grinding parameters on the grinding forces was analyzed by processing the grinding force signals with a low-pass filter based on the rotational speed of the grinding wheel. The experimental results indicated that the difference in grinding force between the peak and valley could be reduced by increasing the grinding wheel speed, which was mainly due to a decrease in average grinding force when the maximum undeformed cutting thickness of the single abrasive decreased. The actual height difference between the grinding surface peak and valley could be realized by increasing the grinding wheel speed. The feed speed of the worktable had no effect on the grinding force signal and the peaks and valleys of the surface morphology. Lower surface roughness could be achieved by reducing the feed speed and increasing the grinding wheel speed.

Investigation of the Anisotropy of 4H-SiC Materials in Nanoindentation and Scratch Experiments.

Silicon carbide is an ideal material for advanced electronics, military, and aerospace applications due to its superior physical and chemical properties. In order to understand the effect of crystal anisotropy of 4H-SiC on its processability, nanoindentation and nanoscratch tests on various crystallographic planes and orientations were performed and the results outlined in this paper. The results show that the C-plane of 4H-SiC is more rigid, while the Si-plane is more elastic and ductile. Better surface quality may be obtained on the Si-plane in nanoscale abrasive machining. The maximum lateral force, maximum residual depth of the scratch, and maximum crack width on the C- and Si-planes of 4H-SiC are significantly periodic in crystallographic orientations at 30° intervals. The scratch along the <112¯0> direction is more prone to crack expansion, and better machined surface quality is easy to obtain along the <101¯0> directions of C- and Si-planes.