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1.
Ultrason Sonochem ; 108: 106957, 2024 Aug.
Article in English | MEDLINE | ID: mdl-38901304

ABSTRACT

In industrial production and scientific research, ultrasonic cavitation technology, with its outstanding physical and chemical processing capabilities, has been widely applied in fields such as material surface modification, chemical synthesis, and biotechnology, becoming a focal point of research and application. This article delves into the effects of different ultrasonic frequencies on cavitation outcomes through the combined use of numerical simulation, fluorescence analysis, and high-speed photography, specifically analyzing the quantitative improvement in the mechanical properties of TC17 titanium alloy under ultrasonic cavitation at frequencies of 20 kHz, 30 kHz, and 40 kHz. The study found that at an ultrasonic frequency of 20 kHz, the maximum expansion radius of cavitation bubbles can reach 51.4 µm, 8.6 times their initial radius. Correspondingly, fluorescence intensity and peak area also increased to 402.8 and 28104, significantly above the baseline level. Moreover, after modification by ultrasonic cavitation, the original machining marks on the surface of TC17 titanium alloy became fainter, with the emergence of new, uniformly distributed microfeatures. The microhardness of the material increased from 373.7 Hv to 383.84 Hv, 396.62 Hv, and 414.06 Hv, with a maximum improvement of 10.8 %. At the same time, surface height difference and roughness significantly decreased (to 3.168 µm and 0.61 µm respectively), with reductions reaching 45.1 % and 42.4 %, indicating a significant improvement in material surface quality. Notably, there is a negative correlation between the improvement of mechanical properties and ultrasonic frequency, suggesting that the improvement effects decrease as ultrasonic frequency increases. This research not only reveals the quantitative relationship between ultrasonic cavitation frequency and material surface modification effects but also provides a solid scientific basis and practical guidance for the application of ultrasonic cavitation technology in surface engineering, signifying the technology's potential for broad application in the future.

2.
Sci Adv ; 10(9): eadl4027, 2024 Mar.
Article in English | MEDLINE | ID: mdl-38427742

ABSTRACT

Microscale thermal signature control using incoherent heat sources remains challenging, despite recent advancements in plasmonic materials and phase-change materials. Inspired by leafhopper-generated brochosomes, we design binary metastructures functioning as pixel twins to achieve pixelated thermal signature control at the microscale. In the infrared range, the pixel twins exhibit distinct emissivities, creating thermal counterparts of "0-1" binary states for storing and displaying information. In the visible range, the engineered surface morphology of the pixel twins ensures similar scattering behaviors. This renders them visually indistinguishable, thereby concealing the stored information. The brochosome-like pixel twins are self-emitting when thermally excited. Their structure-enabled functions do not rely on the permittivities of specific materials, which distinguishes them from the conventional laser-illuminated plasmonic holographic metasurfaces. The unique combination of visible camouflage and infrared display offers a systemic solution to microscale spatial control of thermal signatures and has substantial implications for optical security, anticounterfeiting, and data encryption.

3.
Nano Lett ; 24(5): 1502-1509, 2024 Feb 07.
Article in English | MEDLINE | ID: mdl-38277641

ABSTRACT

With the continuous advancement of nanotechnology, nanodevices have become crucial components in computing, sensing, and energy conversion applications. The structures of nanodevices typically possess subwavelength dimensions and separations, which pose significant challenges for understanding energy transport phenomena in nanodevices. Here, on the basis of a judiciously designed thermal photonic nanodevice, we report the first measurement of near-field energy transport between two coplanar subwavelength structures over temperature bias up to ∼190 K. Our experimental results demonstrate a 20-fold enhancement in energy transfer beyond blackbody radiation. In contrast with the well-established near-field interactions between two semi-infinite bodies, the subwavelength confinements in nanodevices lead to increased polariton scattering and reduction of supporting photonic modes and, therefore, a lower energy flow at a given separation. Our work unveils exciting opportunities for the rational design of nanodevices, particularly for coplanar near-field energy transport, with important implications for the development of efficient nanodevices for energy harvesting and thermal management.

4.
Small ; 19(11): e2207015, 2023 Mar.
Article in English | MEDLINE | ID: mdl-36642828

ABSTRACT

Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition to having high thermal performance. Here, a novel sandwich-structured thermal interface material (TIM) is developed that simultaneously possesses record-low thermal resistance and high flexibility. Frequency-domain thermoreflectance (FDTR) is employed to investigate the overall thermal performance of the sandwich structure. As the core of this sandwich, a vertically aligned copper nanowire (CuNW) array preserves its high intrinsic thermal conductivity, which is further enhanced by 60% via a thick 3D graphene (3DG) coating. The thin copper layers on the top and bottom play the critical roles in protecting the nanowires during device assembly. Through the bottom-up fabrication process, excellent contacts between the graphene-coated CuNWs and the top/bottom layer are realized, leading to minimal interfacial resistance. In total, the thermal resistance of the sandwich is determined as low as ~0.23 mm2  K W-1 . This work investigates a new generation of flexible thermal interface materials with an ultralow thermal resistance, which therefore renders the great promise for advanced thermal management in a wide variety of electronics.

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