Microscale Fracture Behavior of Single Crystal Silicon Beams at Elevated Temperatures.

The micromechanical fracture behavior of Si [100] was investigated as a function of temperature in the scanning electron microscope with a nanoindenter. A gradual increase in KC was observed with temperature, in contrast to sharp transitions reported earlier for macro-Si. A transition in cracking mechanism via crack branching occurs at ∼300 °C accompanied by multiple load drops. This reveals that onset of small-scale plasticity plays an important role in the brittle-to-ductile transition of miniaturized Si.

Approaching the Limits of Strength: Measuring the Uniaxial Compressive Strength of Diamond at Small Scales.

Diamond ⟨100⟩- and ⟨111⟩-oriented nanopillars were fabricated by focused ion beam (FIB) milling from synthetic single crystals and compressed using a larger diameter diamond punch. Uniaxial compressive failure was observed via fracture with a plateau in maximum stress of ∼0.25 TPa, the highest uniaxial strength yet measured. This corresponded to maximum shear stresses that converged toward 75 GPa or ∼ G/7 at small sizes, which are very close to the ultimate theoretical yield stress estimate of G/2π.