Role of defects and grain boundaries in the thermal response of wafer-scale hBN films.

With more widespread applications of nanotechnology, heat dissipation in nanoscale devices is becoming a critical issue. We study the thermal response of wafer-scale hexagonal boron nitride (hBN) layers, which find potential applications as ideal substrates in two dimensional devices. Sapphire-supported thin hBN films, 2'' in size and of different thicknesses, were grown using metalorganic vapour phase epitaxy. These large-scale films exhibit wrinkles defects and grain boundaries over their entire area. The shift of [Formula: see text] phonon mode with temperature is analysed by considering the cumulative contribution of anharmonic phonon decay along with lattice thermal expansion, defect, and strain modulation. The study demonstrates that during heat treatment the strain evolution plays a dominating role in governing the characteristics of the wrinkled thinner films. Interestingly we find that both defects and strain determine the spectral line-width of these wafer-scale films. To the end, from Raman line-width, the changes in phonon lifetime in delaminated and as-grown films is estimated. The results suggest the possibility of a reduction in thermal transport in these wafer-scale films compared to their bulk counterpart.

The effect of nitridation on the polarity and optical properties of GaN self-assembled nanorods.

We report on the effect of nitridation on GaN self-assembled nanorods grown on the c-plane sapphire by metalorganic chemical vapour deposition (MOCVD). Nitridation conditions are found to critically influence the nanorod morphology and optical properties. The nanorod polarity was determined through a direct observation of atomic dumbbell pairs. While purely N-polar wires are obtained under optimised nitridation, incomplete or missing nitridation leads to mixed polarity. By comparing the morphology and the crystal structure with spatially resolved cathodoluminescence results, our study unambiguously establishes a link between appropriate nitridation duration and a homogeneous improvement in optical quality.

Enhanced minority carrier lifetimes in GaAs/AlGaAs core-shell nanowires through shell growth optimization.

The effects of AlGaAs shell thickness and growth time on the minority carrier lifetime in the GaAs core of GaAs/AlGaAs core-shell nanowires grown by metal-organic chemical vapor deposition are investigated. The carrier lifetime increases with increasing AlGaAs shell thickness up to a certain value as a result of reducing tunneling probability of carriers through the AlGaAs shell, beyond which the carrier lifetime reduces due to the diffusion of Ga-Al and/or impurities across the GaAs/AlGaAs heterointerface. Interdiffusion at the heterointerface is observed directly using high-angle annular dark field scanning transmission electron microscopy. We achieve room temperature minority carrier lifetimes of 1.9 ns by optimizing the shell growth with the intention of reducing the effect of interdiffusion.

High vertical yield InP nanowire growth on Si(111) using a thin buffer layer.

We demonstrate the growth of InP nanowires on Si(111) using a thin InP buffer layer. The buffer layer is grown using a two-step procedure. The initial layer formation is ensured by using a very low growth temperature. An extremely high V/III ratio is necessary to prevent In droplet formation at this low temperature. The second layer is grown on the initial layer at a higher temperature and we find that post-growth annealing of the buffer layer does not improve its crystal quality significantly. It is found that the layers inherently have the (111)B polarity. Nanowires grown on this buffer layer have the same morphology and optical properties as nanowires grown on InP (111)B substrates. The vertical yield of the nanowires grown on the buffer layer is over 97% and we also find that crystal defects in the buffer layer do not affect the morphology, vertical yield or optical properties of the nanowires significantly.

Growth and characterization of self-assembled InAs/InP quantum dot structures.

InAs quantum dots (QDs) are grown on InP or lattice matched GaInAsP buffers using horizontal flow metal-organic chemical vapor deposition (MOCVD) at a pressure of 180 mbar. A range of techniques, such as photoluminescence (PL), atomic force microscopy, and plan-view transmission electron microscopy is used to characterize the QD and other semiconductor layers. The effects of different growth parameters, such as V/III ratio and growth time, and the effects of buffer layers, interlayers, and cap layers are investigated and the optimized growth conditions are discussed. In the case of the QDs grown on InP buffers, the As/P exchange reaction is found to be prominent. A very thin (0.6 nm) GaAs interlayer grown between the buffer and the QD layers consumes segregated indium and minimizes the As/P exchange reaction. As a result, the QD PL emission energy increases, the PL intensity improves, and the PL linewidth decreases. The experimental results show that by changing the thickness of a GaAs interlayer (0.3-0.6 nm), the emission wavelength/energy of the QDs grown on a lattice matched GaInAsP buffer can be tuned over a wide range covering 1550 nm. However, further increase in the thickness of the GaAs interlayer results in the agglomeration of the QDs and the deterioration of the QD optical properties. Detailed microscopy studies show that capped QDs have higher density and are smaller in size on average compared to uncapped QDs, which undergo coalescence during cooling of the sample after growth. Overall, the QDs grown for shorter time with a smaller V/III ratio (approximately 8) show improved PL intensity and narrower PL linewidth.

Achieving a narrow size distribution of Au particles at a precise depth in SiO2 by segregation of Au precipitates.

We propose a new method of confining Au nanoparticles of a narrow size distribution at a precise depth in an SiO2 matrix. The process involves the formation of nanocavities in silicon by hydrogen implantation and annealing (at 850 degrees C), followed by Au gettering to and precipitation in such cavities and a wet oxidation at 900 degrees C. Starting with a silicon-on-insulator wafer, Au precipitates can be segregated behind a growing Si/SiO2 interface during wet oxidation and ultimately trapped in SiO2 at the front interface of a buried oxide layer. The shape of the precipitates has been examined by transmission electron microscopy and found to be spherical. The average diameters of these precipitates before and after oxidation have been determined as around 15 nm and 30 nm, respectively.