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1.
ACS Omega ; 9(19): 20637-20647, 2024 May 14.
Article in English | MEDLINE | ID: mdl-38764660

ABSTRACT

Acid copper electroplating stands as a core technology in advanced packaging processes, facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between transistors. The deposition quality of copper interconnect materials has a crucial impact on the final performance of chips, directly influencing their yield, reliability, and stability. In this intricate process, additives play a pivotal role in regulating the deposition quality and behavior of metal copper. This mini-review comprehensively summarizes the recent research progress in the field of electroplating copper additives for advanced packaging, both domestically and internationally, delving into the types and mechanisms of various additive molecules, including accelerators, inhibitors, and leveling agents. Through in-depth research on these additives, we gain a profound understanding of their specific roles in the electroplating process and the intricate interaction mechanisms among them, providing theoretical support for optimizing the electroplating process. Furthermore, this mini-review also delves into a thorough analysis of the current issues and challenges facing acid copper electroplating, exploring the key factors that constrain the further development of electroplating copper technology. Based on this analysis, we propose several potential solutions and research directions, offering crucial references for the development and application of electroplating copper additives in advanced packaging. In conclusion, this mini-review aims to provide a comprehensive perspective and profound understanding of the development and application of electroplating copper additives through a review and analysis of recent research progress, ultimately aiming to promote the further advancement of advanced packaging technology.

2.
ACS Omega ; 9(9): 10929-10936, 2024 Mar 05.
Article in English | MEDLINE | ID: mdl-38463324

ABSTRACT

Chongqing Chengkou manganese deposit is a large carbonate-type manganese deposit in the upper reaches of the Yangtze River, located in Gaoyan Town, Chengkou County, Chongqing. In order to improve the recovery rate of low-grade manganese ore and concentrate grade index, achieve efficient utilization of mineral resources, and sustainable development of Gaoyan manganese ore deposit in Chengkou, Chongqing, China, in this paper, by means of optical microscope analysis, high-resolution X-ray tomography technology, three-dimensional image analysis technology, X-ray diffraction analysis, X-ray fluorescence spectrum analysis, and technical and economic analysis, the occurrence state and process mineralogy of manganese are studied, and the technical and economic analysis of flotation, high-intensity magnetic separation, and gravity separation are carried out. It provides a reference for other mining enterprises to choose the most suitable beneficiation method according to the specific mineral species.

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