Inner Doping of Carbon Nanotubes with Perovskites for Ultralow Power Transistors.

Semiconducting carbon nanotubes (CNTs) are considered as the most promising channel material to construct ultrascaled field-effect transistors, but the perfect sp2 C─C structure makes stable doping difficult, which limits the electrical designability of CNT devices. Here, an inner doping method is developed by filling CNTs with 1D halide perovskites to form a coaxial heterojunction, which enables a stable n-type field-effect transistor for constructing complementary metal-oxide-semiconductor electronics. Most importantly, a quasi-broken-gap (BG) heterojunction tunnel field-effect transistor (TFET) is first demonstrated based on an individual partial-filling CsPbBr3/CNT and exhibits a subthreshold swing of 35 mV dec-1 with a high on-state current of up to 4.9 µA per tube and an on/off current ratio of up to 105 at room temperature. The quasi-BG TFET based on the CsPbBr3/CNT coaxial heterojunction paves the way for constructing high-performance and ultralow power consumption integrated circuits.

Monolithic Three-Dimensional Integration of Carbon Nanotube Circuits and Sensors for Smart Sensing Chips.

Semiconducting carbon nanotube (CNT) film is a promising material for constructing high-performance complementary metal-oxide-semiconductor (CMOS) integrated circuits (ICs) and highly sensitive field-effect transistor (FET) bio/chemical sensors. Moreover, CNT logic transistors and sensors can be integrated through a compatible low-temperature fabrication process, providing enough thermal budget to construct monolithic three-dimensional (M3D) systems for smart sensors. However, an M3D sensing chip based on CNT film has not yet been demonstrated. In this work, we develop M3D technology to fabricate CNT CMOS ICs and CNT sensor arrays in two different layers; then, we demonstrate a preliminary M3D sensing system comprising CNT CMOS interfacing ICs in the bottom layer and CNT sensors in the upper layer through interlayer vias as links. As a typical example, a highly sensitive hydrogen sensing IC has been demonstrated to perform in situ sensing and processing functions through upper-layer FET-based hydrogen sensors exposed to the environment and bottom-layer CNT CMOS voltage-controlled oscillator (VCO) interfacing circuits. The M3D CNT sensing ICs convert hydrogen concentration information (8-128 ppm) to digital frequency information (0.78-1.11 GHz) with a sensitivity of 2.75 MHz/ppm. M3D sensing technology is expected to provide a universal sensing system for future smart sensing chips, including multitarget detection and ultralow power sensors.

Heavy Ion Displacement Damage Effect in Carbon Nanotube Field Effect Transistors.

Recent advances in carbon nanotube (CNT)-based integrated circuits have shown their potential in deep space exploration. In this work, the mechanism governing the heavy-ion-induced displacement damage (DD) effect in semiconducting single-walled CNT field effect transistors (FETs), which is one of the factors limiting device robustness in space, was first and thoroughly investigated. CNT FETs irradiated by a Xe ion fluence of 1012 ions/cm2 can maintain a high on/off current ratio, while transistors' performance failure is observed as the ion fluence increased to 5 × 1012 ions/cm2. Controllable experiments combined with numerical simulations revealed that the degradation mechanism changed as the nonionizing radiation energy built up. The trap generation in the gate dielectric, instead of the CNT channel, was identified as the dominating factor for the high-energy-radiation-induced device failure. Therefore, CNT FETs exhibited a >10× higher DD tolerance than that of Si devices, which was limited by the channel damage under irradiation. More importantly, the distinct failure mechanism determined that CNT FETs can maintain a high DD tolerance of 2.8 × 1013 MeV/g as the technology node scales down to 45 nm node, suggesting the potential of CNT-based VLSI for high-performance and high-robustness space applications.

Ultra-Strong Comprehensive Radiation Effect Tolerance in Carbon Nanotube Electronics.

Carbon nanotube (CNT) field-effect transistors (FETs) have been considered ideal building blocks for radiation-hard integrated circuits (ICs), the demand for which is exponentially growing, especially in outer space exploration and the nuclear industry. Many studies on the radiation tolerance of CNT-based electronics have focused on the total ionizing dose (TID) effect, while few works have considered the single event effects (SEEs) and displacement damage (DD) effect, which are more difficult to measure but may be more important in practical applications. Measurements of the SEEs and DD effect of CNT FETs and ICs are first executed and then presented a comprehensive radiation effect analysis of CNT electronics. The CNT ICs without special irradiation reinforcement technology exhibit a comprehensive radiation tolerance, including a 1 × 104 MeVcm2 mg-1 level of the laser-equivalent threshold linear energy transfer (LET) for SEEs, 2.8 × 1013 MeV g-1 for DD and 2 Mrad (Si) for TID, which are at least four times higher than those in conventional radiation-hardened ICs. The ultrahigh intrinsic comprehensive radiation tolerance will promote the applications of CNT ICs in high-energy solar and cosmic radiation environments.

Ultralow-Power and Radiation-Tolerant Complementary Metal-Oxide-Semiconductor Electronics Utilizing Enhancement-Mode Carbon Nanotube Transistors on Paper Substrates.

The development of eco-friendly, ultralow-power and easy-to-process electronics is facing dominant challenges in emerging off-the-grid applications, such as the Internet of Things (IoTs) and extreme environment explorations at the south/north pole, in the deep sea, and in outer space. Eco-friendly, biodegradable, lightweight, and flexible paper-based electronics can provide many new possibilities for next-generation devices and circuits. Here, enhancement-mode (E-mode, remaining off state at zero gate voltages) carbon nanotube (CNT) complementary metal-oxide-semiconductor (CMOS) thin-film transistors (TFTs) are built on paper substrates through a printing-based process. Benefitting from the CMOS circuit style and E-mode transistors, the fabricated CMOS inverters exhibit high voltage gains (more than 11) and noise margins (up to 75% 1/2 VDD at VDD of 0.4 V), and rail-to-rail operation down to a VDD as low as 0.2 V and record low power dissipation as low as 0.0124 pW µm-1 . Furthermore, the transistors and integrated circuits (ICs) show an excellent radiation tolerance of a total ionizing dose (TID) exceeding 2 Mrad with a high dose rate of 365 rad s-1 . The record power consumption and outstanding radiation tolerance behavior achieved in paper-based and easy-to-process CNT electronics are attractive for emerging energy-saving and environmentally friendly ICs in harsh environment (such as outer-space) applications.

Analyzing Gamma-Ray Irradiation Effects on Carbon Nanotube Top-Gated Field-Effect Transistors.

Carbon nanotube (CNT) field-effect transistors (FETs) and integrated circuits (ICs) have been predicted and demonstrated to be some of the most promising candidates for radiation-hardened electronics. The studies mainly focused on the radiation response of the whole transistors, and experiments or analyses to reveal the detailed radiation responses of different components of the FET were absent. Here, we use a controllable experimental method to decouple the total ionizing dose (TID) radiation effects on different individual components of top-gate CNT FETs, including the CNT channel, gate dielectric, and substrate. The substrate is found to be more vulnerable to radiation damage than the gate dielectric and CNT film in FETs. Furthermore, the CNT film not only acts as a radiation-hardened semiconducting channel but also protects the channel/substrate interface by partially shielding the substrate from radiation damage. On the basis of the experimental data, a model is built to predict the irradiation resistance limit of CNT top-gated FETs, which can withstand at least 155 kGy irradiation.

Carbon Nanotube Based Radio Frequency Transistors for K-Band Amplifiers.

Owing to the combination of high carrier mobility and saturation velocity, low intrinsic capacitance, and excellent stability, the carbon nanotube (CNT) has been considered as a perfect semiconductor to construct radio frequency (RF) field-effect transistors (FETs) and circuits with an ultrahigh frequency band. However, the reported CNT RF FETs usually exhibited poor real performance indicated by the as-measured maximum oscillation frequency (fmax), and then the amplifiers, which are the most important and fundamental RF circuits, suffered from a low power gain and a low frequency band. In this work, we build RF transistors on solution-derived randomly orientated CNT films with improved quality and uniformity. The randomly orientated CNT film FETs exhibit the record as-measured maximum fmax of 90 GHz, demonstrating the potential for over 28 GHz (at least one-third of 90 GHz) 5G mmWave (frequency range 2) applications. Benefiting from the large-scale uniformity of CNT films, FETs are designed and fabricated with a large channel width to present low internal resistance for the standard 50 Ω impedance matching guide line, which is critical to construct an RF amplifier. Furthermore, we first demonstrate amplifiers with a maximum power gain up to 11 dB and output third-order intercept point (OIP3) of 15 dBm, both at the K-band, which represents the record of a CNT amplifier and is even comparable with a commercial amplifier based on III-V RF transistors.

Radiation-Hard and Repairable Complementary Metal-Oxide-Semiconductor Circuits Integrating n-type Indium Oxide and p-type Carbon Nanotube Field-Effect Transistors.

Special radiation-hard and ultralow-power complementary metal-oxide-semiconductor (CMOS) integrated circuits (ICs) are used in the fields of deep space, nuclear energy, and medical X-ray imaging. In this work, we first constructed radiation-hard, repairable, and sub-1 V-driven printed hybrid CMOS field-effect transistors (FETs) and ICs, which integrate printed carbon nanotube (CNT) (band gap ∼ 0.65 eV) p-type FETs and indium oxide (In2O3) (band gap ∼3.64 eV) n-type FETs on glass substrates using a printed PS-PMMA/[EMIM][TFSI] mixture as the gate dielectric layer. The PS-PMMA/[EMIM][TFSI] mixture gate dielectric layer not only lowered the supply voltage (VDD) by providing ultrahigh gate efficiency but also improved the anti-irradiation ability of the hybrid CMOS FETs and ICs. Specifically, the hybrid CMOS inverters exhibited rail-to-rail output with a high voltage gain and high noise margins at a low VDD that could be scaled down to 0.4 V. Furthermore, the hybrid CMOS FETs and ICs showed excellent radiation hardness, that is, withstanding a 3 Mrad (Si) total irradiation dose (TID) at a dose rate of 560 rad s-1 (Si), which is an exceptional result for CMOS transistors and ICs. Furthermore, the radiation-damaged CMOS FETs could be fully recovered by removing and reprinting the PS-PMMA/[EMIM][TFSI] mixture gate dielectric layer, indicating the ability to repair irradiation damage. This work provides an in-space IC fabrication technology.

Aligning Solution-Derived Carbon Nanotube Film with Full Surface Coverage for High-Performance Electronics Applications.

The main challenge for application of solution-derived carbon nanotubes (CNTs) in high performance field-effect transistor (FET) is how to align CNTs into an array with high density and full surface coverage. A directional shrinking transfer method is developed to realize high density aligned array based on randomly orientated CNT network film. Through transferring a solution-derived CNT network film onto a stretched retractable film followed by a shrinking process, alignment degree and density of CNT film increase with the shrinking multiple. The quadruply shrunk CNT films present well alignment, which is identified by the polarized Raman spectroscopy and electrical transport measurements. Based on the high quality and high density aligned CNT array, the fabricated FETs with channel length of 300 nm present ultrahigh performance including on-state current Ion of 290 µA µm-1 (Vds = -1.5 V and Vgs = -2 V) and peak transconductance gm of 150 µS µm-1 , which are, respectively, among the highest corresponding values in the reported CNT array FETs. High quality and high semiconducting purity CNT arrays with high density and full coverage obtained through this method promote the development of high performance CNT-based electronics.