Giant Electromechanical Effect in Piezoelectric Nanomembranes Based on Hf0.5Zr0.5O2.

Since ultrathin ferroelectric HfO2 films can be conformally grown by atomic layer deposition even on complex three-dimensional structures, new horizons in the development of next-generation piezoelectric devices are opened. However, hafnium oxide has a significant drawback for piezoelectric applications: its piezoelectric coefficients are much smaller than those of classical materials currently used in piezoelectric devices. Therefore, new approaches to the development of high-performance piezoelectric devices based on exploiting the unique properties of HfO2 are of paramount importance. In this work, a giant electromechanical effect in miniature piezoelectric membrane devices based on a 10 nm-thick ferroelectric Hf0.5Zr0.5O2 (HZO) film is experimentally demonstrated. Compared to the pure piezoelectric effect in the HZO film, the gain of the electromechanical response in membrane devices reaches 25 times. Numerical simulations confirm that this effect stems from the asymmetric shape of the membranes and can be further improved by designing the device geometry. Furthermore, according to first-principles calculations, an additional opportunity to improve the piezoelectric coefficient, and hence, the device efficiency is provided by the engineering of the mechanical stress in the HZO film. The proposed approach enables the development of new promising piezoelectric devices including miniature reflectors, nanoactuators, and nanoswitches.

Effect of Domain Structure and Dielectric Interlayer on Switching Speed of Ferroelectric Hf0.5Zr0.5O2 Film.

The nanosecond speed of information writing and reading is recognized as one of the main advantages of next-generation non-volatile ferroelectric memory based on hafnium oxide thin films. However, the kinetics of polarization switching in this material have a complex nature, and despite the high speed of internal switching, the real speed can deteriorate significantly due to various external reasons. In this work, we reveal that the domain structure and the dielectric layer formed at the electrode interface contribute significantly to the polarization switching speed of 10 nm thick Hf0.5Zr0.5O2 (HZO) film. The mechanism of speed degradation is related to the generation of charged defects in the film which accompany the formation of the interfacial dielectric layer during oxidization of the electrode. Such defects are pinning centers that prevent domain propagation upon polarization switching. To clarify this issue, we fabricate two types of similar W/HZO/TiN capacitor structures, differing only in the thickness of the electrode interlayer, and compare their ferroelectric (including local ferroelectric), dielectric, structural (including microstructural), chemical, and morphological properties, which are comprehensively investigated using several advanced techniques, in particular, hard X-ray photoelectron spectroscopy, high-resolution transmission electron microscopy, energy dispersive X-ray spectroscopy, X-ray diffraction, and electron beam induced current technique.

Retention Improvement of HZO-Based Ferroelectric Capacitors with TiO2 Insets.

The influence of the bottom TiO2 interfacial layer grown by atomic layer deposition on the ferroelectric properties of the TiN/Hf0.5Zr0.5O2/TiN capacitors is systematically investigated. We show that the integration of the TiO2 layer leads to an increase in the polar orthorhombic phase content in the Hf0.5Zr0.5O2 film. In addition, the crystalline structure of the Hf0.5Zr0.5O2 film is highly dependent on the thickness of the TiO2 inset, with monoclinic phase stabilization after the increase of TiO2 thickness. Special attention in this work is given to the key reliability parameters-retention and endurance. We demonstrate that the integration of the TiO2 inset induces valuable retention improvement. Using a novel approach to the depolarization measurements, we show that the depolarization contribution to the retention loss is insignificant, which leaves the imprint effect as the root of the retention loss in TiN/TiO2/Hf0.5Zr0.5O2/TiN devices. We believe that the integration of the insulator interfacial layer suppresses the scavenging effect from the bottom TiN electrode, leading to a decrease in the oxygen vacancy content in the Hf0.5Zr0.5O2 film, which is the main reason for imprint mitigation. At the same time, although the observed retention improvement is very promising for the upcoming technological integration, the field cycling testing revealed the endurance limitations linked to the phase transitions in the TiO2 layer and the rise of the effective electric field applied to the Hf0.5Zr0.5O2 film.

On-Chip TaO x -Based Non-volatile Resistive Memory for in vitro Neurointerfaces.

The development of highly integrated electrophysiological devices working in direct contact with living neuron tissue opens new exciting prospects in the fields of neurophysiology and medicine, but imposes tight requirements on the power dissipated by electronics. On-chip preprocessing of neuronal signals can substantially decrease the power dissipated by external data interfaces, and the addition of embedded non-volatile memory would significantly improve the performance of a co-processor in real-time processing of the incoming information stream from the neuron tissue. Here, we evaluate the parameters of TaO x -based resistive switching (RS) memory devices produced by magnetron sputtering technique and integrated with the 180-nm CMOS field-effect transistors as possible candidates for on-chip memory in the hybrid neurointerface under development. The electrical parameters of the optimized one-transistor-one-resistor (1T-1R) devices, such as the switching voltage (approx. ±1 V), uniformity of the R off/R on ratio (∼10), read/write speed (<40 ns), and the number of the writing cycles (up to 1010), are satisfactory. The energy values for writing and reading out a bit ∼30 and ∼0.1 pJ, respectively, are also suitable for the desired in vitro neurointerfaces, but are still far too high once the prospective in vivo applications are considered. Challenges arising in the course of the prospective fabrication of the proposed TaO x -based RS devices in the back-end-of-line process are identified.