ABSTRACT
Two-dimentional semiconductors have shown potential applications in multi-bridge channel field-effect transistors (MBC-FETs) and complementary field-effect transistors (C-FETs) due to their atomic thickness, stackability, and excellent electrical properties. However, the exploration of MBC-FET and C-FET based on large-scale 2D semiconductors is still lacking. Here, based on a reliable vertical stacking of wafer-scale 2D semiconductors, large-scale MBC-FETs and C-FETs using n-type MoS2 and p-type MoTe2 are successfully fabricated. The drive current of an MBC-FET with two layers of MoS2 channel (20 µm/10 µm) is up to 60 µA under 1 V bias. Compared with the single-gate MoS2 FET, the carrier mobility of MBC-FET is 2.3 times higher and the sub-threshold swing is 70% smaller. Furthermore, NAND and NOR logic circuits are also constructed based on two vertically stacked MoS2 channels. Then, C-FET arrays are fabricated by 3D integrating n-type MoS2 FET and p-type MoTe2 FET, which exhibit a voltage gain of 7 V/V when VDD = 4 V. In addition, this C-FET device can directly convert light signals to an electrical digital signal within a single device. The demonstration of MBC-FET and C-FET based on large-scale 2D semiconductors will promote the application of 2D semiconductors in next-generation circuits.
