ABSTRACT
Investigating biodegradable and biocompatible materials for electronic applications can lead to tangible outcomes such as developing green-electronic devices and reducing the amount of e-waste. The proposed emulsion-based conducting ink formulation takes into consideration circular economy and green principles throughout the entire process, from the selection of materials to the production process. The ink is formulated using the biopolymer polylactic acid dissolved in a sustainable solvent mixed with water, along with conductive carbon nanotubes (CNTs) and silver flakes as fillers. Hybrid conductive fillers can lower the percolation threshold of the ink and the production costs, while maintaining excellent electrical properties. The coating formed after the deposition of the ink, undergoes isothermal treatment at different temperatures and durations to improve its adhesion and electrical properties. The coating's performance was evaluated by creating an eight-finger interdigitated sensor using a Voltera PCB printer. The sensor demonstrates exceptional performance when exposed to various loading and unloading pressures within the 0.2-500.0 kPa range. The results show a consistent correlation between the change in electrical resistance and the stress caused by the applied load. The ink is biodegradable in marine environments, which helps avoiding its accumulation in the ecosystem over time.
ABSTRACT
The development of this work lies in the relevant interest in epoxy resins, which, despite their wide use, do not meet the requirements for sustainable materials. Therefore, the proposed approach considers the need to develop environmentally friendly systems, in terms of both the starting material and the synthetic method applied as well as in terms of end-of-life. The above issues were taken into account by (i) using a monomer from renewable sources, (ii) promoting the formation of dynamic covalent bonds, allowing for material reprocessing, and (iii) evaluating the degradability of the material. Indeed, an epoxy derived from cardanol was used, which, for the first time, was applied in the development of a vitrimer system. The exploitation of a diboronic ester dithiol ([2,2'-(1,4-phenylene)-bis[4-mercaptan-1,3,2-dioxaborolane], DBEDT) as a cross-linker allowed the cross-linking reaction to be carried out without the use of solvents and catalysts through a thiol-epoxy "click" mechanism. The dynamicity of the network was demonstrated by gel fraction experiments and rheological and DMA measurements. In particular, the formation of a vitrimer was highlighted, characterized by low relaxation times (around 4 s at 70 °C) and an activation energy of ca. 48 kJ/mol. Moreover, the developed material, which is easily biodegradable in seawater, was found to show promising flame reaction behavior. Preliminary experiments demonstrated that, unlike an epoxy resin prepared from the same monomer and using a classical cross-linker, our boron-containing material exhibited no dripping under combustion conditions, a phenomenon that will allow this novel biobased system to be widely used.
ABSTRACT
Printed circuit boards (PCBs) physically support and connect electronic components to the implementation of complex circuits. The most widespread insulating substrate that also acts as a mechanical support in PCBs is commercially known as FR4, and it is a glass-fiber-reinforced epoxy resin laminate. FR4 has exceptional dielectric, mechanical, and thermal properties. However, it was designed without considering sustainability and end-of-life aspects, heavily contributing to the accumulation of electronic waste in the environment. Thus, greener alternatives that can be reprocessed, reused, biodegraded, or composted at the end of their function are needed. This work presents the development and characterization of a PCB substrate based on poly(lactic acid) and cotton fabric, a compostable alternative to the conventional FR4. The substrate has been developed by compression molding, a process compatible with the polymer industry. We demonstrate that conductive silver ink can be additively printed on the substrate's surface, as its morphology and wettability are similar to those of FR4. For example, the compostable PCB's water contact angle is 72°, close to FR4's contact angle of 64°. The developed substrate can be thermoformed to curved surfaces at low temperatures while preserving the conductivity of the silver tracks. The green substrate has a dielectric constant comparable to that of the standard FR4, showing a value of 5.6 and 4.6 at 10 and 100 kHz, respectively, which is close to the constant value of 4.6 of FR4. The substrate is suitable for microdrilling, a fundamental process for integrating electronic components to the PCB. We implemented a proof-of-principle circuit to control the blinking of LEDs on top of the PCB, comprising resistors, capacitors, LEDs, and a dual in-line package circuit timer. The developed PCB substrate represents a sustainable alternative to standard FR4 and could contribute to the reduction of the overwhelming load of electronic waste in landfills.
ABSTRACT
Highly stretchable biobased and biodegradable agricultural mulch films based on polylactic acid (PLA) and 10, 20, or 30 wt % various nonedible vegetable wastes such as spinach stems (SS), tomato pomace (TP), and cocoa shells (CS) are prepared and characterized in this work. The results demonstrate that appropriate PLA plasticization and vegetable waste addition allow for obtaining films suitable for mulching with tensile strengths in the 10-24 MPa range and elongations at break up to 460%, depending on the kind and amount of vegetable waste incorporated. Additionally, the developed mulches show low water solubility (1-15 wt %) and moisture content (1-3 wt %) with a water vapor permeability of up to 3 × 10-10 g s-1 m-1 Pa-1, similar to that of Mater-Bi. In addition, the type of vegetable waste added as filler were demonstrated to significantly affect not only the films' mentioned properties but also their biodegradability. For instance, films prepared with 20 wt % SS were demonstrated to improve PLA soil biodegradability, which increased from 0 to 38 wt % for PLA composites after 6 months of a soil burial experiment. Lastly, the developed composites contain different amounts of plant micro- and macronutrients, indicating their potential as fertilizers. The results found in this work represent a sustainable, fully biobased alternative to other mulches already in the market.
