Effects of Poly-Si Grain Boundary on Retention Characteristics under Cross-Temperature Conditions in 3-D NAND Flash Memory.

Electrical characteristics with various program temperatures (TPGM) in three-dimensional (3-D) NAND flash memory are investigated. The cross-temperature conditions of the TPGM up to 120 °C and the read temperature (TREAD) at 30 °C are used to analyze the influence of grain boundaries (GB) on the bit line current (IBL) and threshold voltage (VT). The VT shift in the E-P-E pattern is successfully decomposed into the charge loss (ΔVT,CL) component and the poly-Si GB (ΔVT,GB) component. The extracted ΔVT,GB increases at higher TPGM due to the reduced GB potential barrier. Additionally, the ΔVT,GB is evaluated using the Technology Computer Aided Design (TCAD) simulation, depending on the GB position (XGB) and the bit line voltage (VBL).

Organizing Reliable Polymer Electrode Lines in Flexible Neural Networks via Coffee Ring-Free Micromolding in Capillaries.

With an increase in the demand for smart wearable systems, artificial synapse arrays for flexible neural networks have received considerable attention. A synaptic device with a two-terminal configuration is promising for complex neural networks because of its ability to scale to a crossbar array architecture. To realize practical crossbar arrays with a high density, it is essential to achieve reliable electrode lines that act as signal terminals. However, an effective method to develop intrinsically flexible signal lines in artificial neural networks has not been developed. In this study, we achieved reliable polymer signal lines for flexible neural networks using coffee ring-free micromolding in capillaries (MIMIC). In a typical MIMIC, the outward convective flow of the polymer solution inherently deteriorates the pattern fidelity. To achieve reliable conducting polymer (CP) lines, we precisely controlled the flow of the polymer solution in the MIMIC by inducing the Marangoni force. When the convective and Marangoni flows for the solution were balanced in the MIMIC, the CP line patterns were reliably produced with high fidelity. The developed CP lines exhibited superior conductivity and high mechanical flexibility. Moreover, flexible memristor arrays consisting of CP signal lines demonstrated a high potential for realizing practical neuromorphic systems linked to artificial intelligence.