RESUMEN
2205 DSS is an excellent corrosion-resistant engineering metal material, but it is still threatened by microbiological corrosion. The addition of copper elements is a new approach to improving the resistance of 2205 DSS to microbiological corrosion. In this study, 2205-Cu DSS was compared with 2205 DSS to study its antimicrobial properties and resistance to microbiological corrosion in the presence of the electroactive bacterium Shewanella algae. The results showed that compared to 2205 DSS, the biofilm thickness and the number of live bacteria on the surface of 2205-Cu DSS were significantly reduced, demonstrating excellent antimicrobial properties against S. algae. Electrochemical tests and surface morphology characterization results showed that the corrosion rate and pitting of 2205-Cu DSS by S. algae were lower than that of 2205 DSS, indicating better resistance to microbiological corrosion. The good antimicrobial properties and resistance to microbiological corrosion exhibited by 2205-Cu DSS are attributed to the contact antimicrobial properties of copper elements in the 2205-Cu DSS matrix and the release of copper ions for antimicrobial effects. This study provides a new strategy for combating microbiological corrosion.