Lateral bipolar junction transistor on a silicon photonics platform.

Integration of active electronics into photonic systems is necessary for large-scale photonic integration. While heterogeneous integration leverages high-performance electronics, a monolithic scheme can coexist by aiding the electronic processing, improving overall efficiency. We report a lateral bipolar junction transistor on a commercial silicon photonics foundry process. We achieved a DC current gain of 10 with a Darlington configuration, and using measured S-parameters for a single BJT, the available AC gain was at least 3dB for signal frequencies up to 1.1 GHz. Our single BJT demonstrated a transimpedance of 3.2mS/µm, which is about 70 times better than existing literature.

Photonic principal component analysis using an on-chip microring weight bank.

Photonic principal component analysis (PCA) enables high-performance dimensionality reduction in wideband analog systems. In this paper, we report a photonic PCA approach using an on-chip microring (MRR) weight bank to perform weighted addition operations on correlated wavelength-division multiplexed (WDM) inputs. We are able to configure the MRR weight bank with record-high accuracy and precision, and generate multi-channel correlated input signals in a controllable manner. We also consider the realistic scenario in which the PCA procedure remains blind to the waveforms of both the input signals and weighted addition output, and propose a novel PCA algorithm that is able to extract principal components (PCs) solely based on the statistical information of the weighted addition output. Our experimental demonstration of two-channel photonic PCA produces PCs holding consistently high correspondence to those computed by a conventional software-based PCA method. Our numerical simulation further validates that our scheme can be generalized to high-dimensional (up to but not limited to eight-channel) PCA with good convergence. The proposed technique could bring new solutions to problems in microwave communications, ultrafast control, and on-chip information processing.

Ultra-short beam expander with segmented curvature control: the emergence of a semi-lens.

We introduce direct curvature control in designing a segmented beam expander, and explore novel design possibilities for ultra-compact beam expanders. Assisted by the particle swarm optimization algorithm, we search for an optimal curvature-controlled multi-segment taper that maintains width continuity. Counterintuitively, the optimization yields a structure with abrupt width discontinuity and width compression features. Through spatial phase and parameterized analysis, a semi-lens feature is revealed that helps to flatten the wavefront at the output end for higher coupling efficiency. Such functionality cannot be achieved by normal tapers in a short distance. The structure is fabricated and characterized experimentally. By a figure of merit that accounts for expansion ratio, length, and efficiency, this structure outperforms an adiabatic taper by 9 times.

MgZnO High Voltage Thin Film Transistors on Glass for Inverters in Building Integrated Photovoltaics.

Building integrated photovoltaics (BIPV) have attracted considerable interests because of its aesthetically attractive appearance and overall low cost. In BIPV, system integration on a glass substrate like windows is essential to cover a large area of a building with low cost. However, the conventional high voltage devices in inverters have to be built on the specially selected single crystal substrates, limiting its application for large area electronic systems, such as the BIPV. We demonstrate a Magnesium Zinc Oxide (MZO) based high voltage thin film transistor (HVTFT) built on a transparent glass substrate. The devices are designed with unique ring-type structures and use modulated Mg doping in the channel - gate dielectric interface, resulting in a blocking voltage of over 600 V. In addition to BIPV, the MZO HVTFT based inverter technology also creates new opportunities for emerging self-powered smart glass.

High-density waveguide superlattices with low crosstalk.

Silicon photonics holds great promise for low-cost large-scale photonic integration. In its future development, integration density will play an ever-increasing role in a way similar to that witnessed in integrated circuits. Waveguides are perhaps the most ubiquitous component in silicon photonics. As such, the density of waveguide elements is expected to have a crucial influence on the integration density of a silicon photonic chip. A solution to high-density waveguide integration with minimal impact on other performance metrics such as crosstalk remains a vital issue in many applications. Here, we propose a waveguide superlattice and demonstrate advanced superlattice design concepts such as interlacing-recombination that enable high-density waveguide integration at a half-wavelength pitch with low crosstalk. Such waveguide superlattices can potentially lead to significant reduction in on-chip estate for waveguide elements and salient enhancement of performance for important applications, opening up possibilities for half-wavelength-pitch optical-phased arrays and ultra-dense space-division multiplexing.