Observation of Nonlinear Harmonic Generation of Bulk Modes in SAW Devices.

Nonlinear generation of harmonics is measured on the wafer level on temperature compensated surface-acoustic-wave resonators on lithium niobate. The second-harmonic response features strong peaks looking like multiple resonant modes. The product of the frequency difference between the successive peaks to the substrate thickness is found to remain almost constant. The results also show that the level of the harmonic signal strongly depends on the roughness of the back side of the substrate. Due to these findings, it was assumed that the signal is due to nonlinear generation of a bulk mode. This assumption is confirmed experimentally by measuring the second-harmonic wave field on the back side of the substrate with an interferometer. Possible nonlinear mechanisms explaining these results are discussed.

Transformation of acoustic waves in periodic metal grating sandwiched between piezoelectric and dielectric.

The mechanism of SAW transformation with variation of film thickness is investigated in a piezoelectric substrate with a metal grating overlaid by a dielectric film, via simulation and visualization of the acoustic fields. By way of example, two orientations of lithium niobate substrates are analyzed, YX-LN and 128°YX-LN, with a Cu grating and an isotropic silica glass overlay. The motions, which follow the wave propagation in the sagittal plane, are visualized within two periods of the grating, with added contour plots showing the shear horizontal displacements. The continuous transformation of the wave's nature is investigated for each wave propagating in the analyzed material structures when the film thickness is increased from zero to a few wavelengths. The examples of the SAW transformation into boundary waves and into plate modes of different polarization have been found and investigated. The behavior of the SAW characteristics in the grating is correlated with transformation of the wave structure with increasing overlay thickness.

Design of miniaturized RF SAW duplexer package.

This paper provides a comprehensive methodology for accurate analysis and design of miniaturized radio frequency (RF) surface acoustic wave (SAW) duplexer package. Full-wave analysis based on the three dimensional (3-D) finite element method (FEM) is applied to get the package model. The die model is obtained by combining the parasitics and acoustics models. The modeling of bonding wire is also discussed. The models of package, die, and bonding wires are assembled together to get the total response. Based on this methodology, several novel ideas are proposed to significantly improve the isolation. Simulation and measurement results are compared, and excellent agreement is found. The technique developed in this paper reduces the design cycle time greatly and can be applied to various RF SAW device packages.