Effect of carbon addition on the passivity of hypoeutectic high chromium cast irons.

The effect of adding C on the passivity of hypoeutectic high chromium cast iron (HCCI) was investigated in a pH 8.4 boric-borate buffer solution. The microstructure of HCCI is composed of austenite and carbide phases, whose fractions and chemical compositions are influenced by the amount of C added. Electrochemical and surface analyses revealed that the addition of C in the HCCI increased the defect densities in the n-type and p-type semiconductive oxide layers on the austenite and carbide phases, respectively.

Simultaneous increase in strength and ductility by decreasing interface energy between Zn and Al phases in cast Al-Zn-Cu alloy.

Cast-Al alloys that include a high amount of the second element in their matrix have comparatively high strength but low ductility because of the high volume fraction of strengthening phases or undesirable inclusions. Al-Zn alloys that have more than 30 wt% Zn have a tensile strength below 300 MPa, with elongation under 5% in the as-cast state. However, we found that after substitution of 2% Zn by Cu, the tensile strength of as-cast Al-Zn-Cu alloys was 25% higher and ductility was four times higher than for the corresponding Al-35% Zn alloy. Additionally, for the Al-43% Zn alloy with 2% Cu after 1 h solution treatment at 400 °C and water quenching, the tensile strength unexpectedly reached values close to 600 MPa. For the Al-33% Zn alloy with 2% Cu, the tensile strength was 500 MPa with 8% ductility. The unusual trends of the mechanical properties of Al-Zn alloys with Cu addition observed during processing from casting to the subsequent solution treatment were attributed to the precipitation of Zn in the Al matrix. The interface energy between the Zn particles and the Al matrix decreased when using a solution of Cu in Zn.

Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles.

The development of Cu-based alloys with high-mechanical properties (strength, ductility) and electrical conductivity plays a key role over a wide range of industrial applications. Successful design of the materials, however, has been rare due to the improvement of mutually exclusive properties as conventionally speculated. In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled. We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes. It is shown that the Ti dramatically drives the interfacial phase transformation from very irregular to homogeneous spherical morphologies resulting in substantial enhancement of the mechanical property of Cu matrix. Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu. We validate experimental results using TEM and EDX combined with first-principles density functional theory (DFT) calculations, which all consistently poise that our materials are suitable for industrial applications.

Electrochemical migration characteristics of screen-printed silver patterns on FR-4 substrate.

We evaluated the electrical reliability of screen-printed silver (Ag) patterns sintered at various temperatures under variable bias voltages. Comb-type patterns were screen-printed onto a flame resistance-4 substrate using a commercial Ag nanopaste (24 nm in diameter, 73 wt% of Ag nanoparticles). The printed patterns were then sintered for 30 min in air at various temperatures ranging from 100 degrees C to 200 degrees C. The microstructures and thickness profiles of the sintered conductive patterns were identified with a field emission scanning electron microscope and a 3-D surface profiler, respectively. In this study, the phenomenon of electrochemical migration was investigated with a water drop test with deionized water. These results showed that the time required by dendrites to bridge from a cathode to an anode was affected by the sintering temperature and applied voltage; when the sintering temperature was 200 degrees C, the time to achieve a short circuit was nearly four times that of the sample sintered at 100 degrees C, and while the applied voltage increased from 3 V to 9 V, the time to reach a short circuit decreased, on average, by 11%.

Evaluation of the flexibility of silver circuits screen-printed on polyimide with an environmental reliability test.

The flexibility of screen-printed silver (Ag) circuits on a polyimide (PI) substrate was investigated under a high temperature and relative humidity (RH). The conductive circuits were constructed on a PI film with a commercial Ag nanopaste via screen printing. The printed patterns were sintered at 200 degrees C for 30 min in a box-type furnace, after which they were placed in a chamber at 85 degrees C/85% RH for various durations: 100, 300, 500, and 1000 h. The Institute for Interconnecting and Packaging Electronic Circuits (IPC) flexural resistance endurance test was conducted to measure the flexibility of the conductive circuits, and the flexibility of the printed patterns was evaluated by detecting the variation of the electrical resistance. The flexibility of the screen-printed conductive circuits decreased as the duration of the 85 degrees C/85% RH test increased. After the 1000 h run of the 85 degrees C/85% RH test, the flexibility of the printed circuits was almost halved compared to that after the 100 h test. To demonstrate the decreased flexibility, the microstructural evolution and partial volume were investigated with a field emission scanning electron microscope (FE-SEM) and a 3D surface profiler, respectively.

Effect of sintering temperature on electrical characteristics of screen-printed Ag nanopaste on FR4 substrate.

We investigated the feasibility of a printing technology for Ag circuit formation on a FR4 substrate. A conductive paste containing Ag nanoparticles (73 wt%) of 20-50 nm diameter was screen printed on an FR4 substrate and sintered under a sintering temperature ranging from 100 degrees C to 200 degrees C for 30 min. We carried out the thermal analysis of the Ag nanopaste to confirm the suitability of the set-up conditions. To investigate the sintering degree with various temperatures, fractured cross-sections were observed by field emission scanning electron microscopy (FESEM). For electrical characterization of the printed Ag circuit, a four-point probe method was used to measure the direct current (DC) resistivity, while a network analyzer and Cascade's probe system in the frequency range from 10 MHz to 20 GHz were used to measure the scattering parameters (S-parameter) of the sintered Ag conducting patterns. The resistivity under the application of a DC signal decreased as the temperature increased. The measured S-parameters indicated that the electrical losses decreased as the sintering temperature increased due to the interparticle neck formation after heat treatment at high temperatures.