RESUMO
Perfect absorber type devices are well-suited to many applications, such as solar cells, spatial light modulators, bio-sensors, and highly-sensitive photo-detectors. In such applications, a method for the design and fabrication of devices in a simple and efficient way, while at the same time maintaining design control over the key performance characteristics of resonant frequency, reflection coefficient at resonance and quality factor, would be particularly advantageous. In this work we develop such a method, based on eigenmode analysis and critical coupling theory, and apply it to the design of reconfigurable phase-change metasurface absorber devices. To validate the method, the design and fabrication of a family of absorbers was carried out with a range of 'on-demand' quality factors, all operating at the same resonant frequency and able to be fabricated simply and simultaneously on the same chip. Furthermore, by switching the phase-change layer between its amorphous and crystalline states, we show that our devices can provide an active or reconfigurable functionality.
RESUMO
Graphene oxide (GO) resistive memories offer the promise of low-cost environmentally sustainable fabrication, high mechanical flexibility and high optical transparency, making them ideally suited to future flexible and transparent electronics applications. However, the dimensional and temporal scalability of GO memories, i.e., how small they can be made and how fast they can be switched, is an area that has received scant attention. Moreover, a plethora of GO resistive switching characteristics and mechanisms has been reported in the literature, sometimes leading to a confusing and conflicting picture. Consequently, the potential for graphene oxide to deliver high-performance memories operating on nanometer length and nanosecond time scales is currently unknown. Here we address such shortcomings, presenting not only the smallest (50 nm), fastest (sub-5 ns), thinnest (8 nm) GO-based memory devices produced to date, but also demonstrate that our approach provides easily accessible multilevel (4-level, 2-bit per cell) storage capabilities along with excellent endurance and retention performance-all on both rigid and flexible substrates. Via comprehensive experimental characterizations backed-up by detailed atomistic simulations, we also show that the resistive switching mechanism in our Pt/GO/Ti/Pt devices is driven by redox reactions in the interfacial region between the top (Ti) electrode and the GO layer.
