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1.
Micromachines (Basel) ; 14(4)2023 Apr 14.
Artigo em Inglês | MEDLINE | ID: mdl-37421080

RESUMO

In recent years, Micro-Electro-Mechanical Systems (MEMS) technology has had an impressive impact in the field of acoustic transducers, allowing the development of smart, low-cost, and compact audio systems that are employed in a wide variety of highly topical applications (consumer devices, medical equipment, automotive systems, and many more). This review, besides analyzing the main integrated sound transduction principles typically exploited, surveys the current State-of-the-Art scenario, presenting the recent performance advances and trends of MEMS microphones and speakers. In addition, the interface Integrated Circuits (ICs) needed to properly read the sensed signals or, on the other hand, to drive the actuation structures are addressed with the aim of offering a complete overview of the currently adopted solutions.

2.
Sensors (Basel) ; 23(5)2023 Mar 02.
Artigo em Inglês | MEDLINE | ID: mdl-36904929

RESUMO

InfraRed Focal Plane Arrays (IRFPAs) are crucial components in a wide range of applications, including night vision, thermal imaging and gas sensing. Among the various types of IRFPAs, micro-bolometer-based ones have gained significant attention due to their high sensitivity, low noise and low cost. However, their performance is heavily dependent on the readout interface, which converts the analog electrical signals provided by the micro-bolometers into digital signals for further processing and analysis. This paper briefly introduces these kinds of devices and their function, reporting and discussing a list of key parameters used to evaluate their performance; after that, the focus is shifted to the readout interface architecture with particular attention to the different strategies adopted, across the last two decades, in the design and development of the main blocks included in the readout chain.

3.
Micromachines (Basel) ; 13(11)2022 Nov 19.
Artigo em Inglês | MEDLINE | ID: mdl-36422453

RESUMO

This paper presents an extensive review of the main highlights in the Temperature-to-Digital Converters (TDCs) field, which has gained importance and research interest throughout the last two decades. The key techniques and approaches that have led to the evolution of this kind of systems are presented and compared; their peculiarities are identified in order to highlight the pros and cons of the different design methods, and the main trade-offs are extracted from this analysis. Finally, the trends that have emerged from the performance evaluation of the large amount of published works in this field are identified with the purpose of providing a directional view of the past, present and future features of these devices.

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