RESUMO
Notwithstanding its excellent properties such as high work function and low resistance, Ru has not been widely applied in the preparation of electrodes for various electronic devices. This is because of the occurrence of severe morphological degradation in the actual devices employing Ru. Herein, we investigated Ru chemistry for electrode application and the degradation mechanism of Ru during subsequent processes such as thin film deposition or thermal annealing. We revealed that subsurface oxygen induces Ru degradation owing to the alteration of Ru chemistry by the pretreatment under various gas ambient conditions and due to the growth behavior of TiO2 deposited via atomic layer deposition (ALD). The degradation of Ru is successfully ameliorated by conducting an appropriate pretreatment prior to ALD. The TiO2 thin film deposited on the pretreated Ru electrode exhibited a rutile-phased crystal structure and smooth surface morphology, thereby resulting in excellent electrical properties. This paper presents an important development in the application of Ru as the electrode that can facilitate the development of various next-generation electronic devices.
