Highly stable coherent nanoprecipitates via diffusion-dominated solute uptake and interstitial ordering.

Lightweight design strategies and advanced energy applications call for high-strength Al alloys that can serve in the 300‒400 °C temperature range. However, the present commercial high-strength Al alloys are limited to low-temperature applications of less than ~150 °C, because it is challenging to achieve coherent nanoprecipitates with both high thermal stability (preferentially associated with slow-diffusing solutes) and large volume fraction (mostly derived from high-solubility and fast-diffusing solutes). Here we demonstrate an interstitial solute stabilizing strategy to produce high-density, highly stable coherent nanoprecipitates (termed the V phase) in Sc-added Al-Cu-Mg-Ag alloys, enabling the Al alloys to reach an unprecedented creep resistance as well as exceptional tensile strength (~100 MPa) at 400 °C. The formation of the V phase, assembling slow-diffusing Sc and fast-diffusing Cu atoms, is triggered by coherent ledge-aided in situ phase transformation, with diffusion-dominated Sc uptake and self-organization into the interstitial ordering of early-precipitated Ω phase. We envisage that the ledge-mediated interaction between slow- and fast-diffusing atoms may pave the way for the stabilization of coherent nanoprecipitates towards advanced 400 °C-level light alloys, which could be readily adapted to large-scale industrial production.

Freezing solute atoms in nanograined aluminum alloys via high-density vacancies.

Low-temperature decomposition of supersaturated solid solution into unfavorable intergranular precipitates is a long-standing bottleneck limiting the practical applications of nanograined aluminum alloys that are prepared by severe plastic deformation. Minimizing the vacancy concentration is generally regarded as an effective approach in suppressing the decomposition process. Here we report a counterintuitive strategy to stabilize supersaturated solid solution in nanograined Al-Cu alloys via high-density vacancies in combination with Sc microalloying. By generating a two orders of magnitude higher concentration of vacancies bonded in strong (Cu, Sc, vacancy)-rich atomic complexes, a high thermal stability is achieved in an Al-Cu-Sc alloy that precipitation is nearly suppressed up to ~230 °C. The solute-vacancy complexes also enable the nanograined Al-Cu alloys with higher strength, greater strain hardening capability and ductility. These findings provide perspectives towards the great potentials of solute-vacancy interaction and the development of nanograined alloys with high stability and well-performed mechanical properties.

Influence of hydrogenation on the mechanical properties of Pd nanoparticles.

Atomic simulations are conducted to investigate the influence of hydrogenation on the mechanical properties of Pd nanoparticles. It is found that with an increase in the H atom content both the elastic modulus and the yield stress decrease approximately linearly. Moreover, the H atom content evidently alters the atomic deformation mechanisms in Pd nanoparticles. When the H atom content is in the range of 0-0.3, yield initiates from dislocation nucleating beneath surface steps and then a pyramid hillock is formed. Subsequently, dislocation nucleation and exhaustion at the surface will govern the plastic deformation. However, when the H atom content is in the range of 0.3-0.4, massive initial defects are introduced by hydrogenation, which partially suppress the dislocation nucleation around the surface steps, and no pyramid dislocation hillock is formed. Dislocation multiplication will dominate the subsequent plastic deformation. Moreover, as the H atom content increases to 0.4-0.5, the recoverable phase transition plays a key role in the plastic deformation. This study enriches our understanding of the impact of hydrogenation on the mechanical properties and deformation mechanisms of Pd nanoparticles.

Abrupt elastic-to-plastic transition in pentagonal nanowires under bending.

In this study, pentagonal Ag and Au nanowires (NWs) were bent in cantilever beam configuration inside a scanning electron microscope. We demonstrated an unusual, abrupt elastic-to-plastic transition, observed as a sudden change of the NW profile from smooth arc-shaped to angled knee-like during the bending in the narrow range of bending angles. In contrast to the behavior of NWs in the tensile and three-point bending tests, where extensive elastic deformation was followed by brittle fracture, in our case, after the abrupt plastic event, the NW was still far from fracture and enabled further bending without breaking. A possible explanation is that the five-fold twinned structure prevents propagation of critical defects, leading to dislocation pile up that may lead to sudden stress release, which is observed as an abrupt plastic event. Moreover, we found that if the NWs are coated with alumina, the abrupt plastic event is not observed and the NWs can withstand severe deformation in the elastic regime without fracture. The coating may possibly prevent formation of dislocations. Mechanical durability under high and inhomogeneous strain fields is an important aspect of exploiting Ag and Au NWs in applications like waveguiding or conductive networks in flexible polymer composite materials.

Atomistic deformation mechanisms in twinned copper nanospheres.

In the present study, we perform molecular dynamic simulations to investigate the compression response and atomistic deformation mechanisms of twinned nanospheres. The relationship between load and compression depth is calculated for various twin spacing and loading directions. Then, the overall elastic properties and the underlying plastic deformation mechanisms are illuminated. Twin boundaries (TBs) act as obstacles to dislocation motion and lead to strengthening. As the loading direction varies, the plastic deformation transfers from dislocations intersecting with TBs, slipping parallel to TBs, and then to being restrained by TBs. The strengthening of TBs depends strongly on the twin spacing.